NE5534, NE5534A, SA5534, SA5534A

SLOS070D – JULY 1979 – REVISED NOVEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

TYP

MAX

UNIT

VCC+

0

22

V

VCC

Supply voltage(2)

VCC–

–22

0

V

Input voltage, either input(2)(3)

VCC–

VCC+

V

Input current(4)

–10

10

mA

Duration of output short circuit(5)

Unlimited

TJ

Operating virtual-junction temperature

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the midpoint between VCC+ and VCC–.

(3)

The magnitude of the input voltage must never exceed the magnitude of the supply voltage.

(4)

Excessive current will flow if a differential input voltage in excess of approximately 0.6 V is applied between the inputs, unless some

limiting resistance is used.

(5)

The output may be shorted to ground or either power supply. Temperature and/or supply voltages must be limited to ensure the

maximum dissipation rating is not exceeded.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

0

2000

all pins

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

0

200

JESD22-C101, all pins

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC+

5

15

V

VCC

Supply voltage

VCC–

–5

–15

V

NE5534, NE5534A

0

70

TA

Operating free-air temperature

°C

SA5534, SA5534A

–40

85

7.4 Thermal Information

NE5534, NE5534A

SA5534, and SA5534A

THERMAL METRIC(1)

UNIT

D

P

PS

8 PINS

RθJA

Package thermal impedance(2)(3)

97

85

95

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

(3)

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

4

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