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Notes

A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.

B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.

C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled

to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp

PowerSplitter/Combiner

MMIC Surface Mount

Product Overview

Mini-Circuits EP2C+ is a MMIC splitter/combiner designed for wideband operation from 1800 to 12500 MHz. This

model provides excellent power ratings in a tiny device package (4x4x1 mm), with up to 1.85W power handling

(as a splitter) and up to 0.4A DC current handling. Manufactured using GaAs IPD technology, it provides a high

level of ESD protection and excellent reliability.

Feature

Advantages

Wideband, 1800 to 12500 MHz

One power splitter can be used in many applications, saving component count. Also ideal for

wideband applications such as military and instrumentation.

Excellent power handling

1.85W as a splitter

0.85W internal dissipation as a combiner

In power combiner applications, half the power is dissipated internally. EP2C+ is designed to

handle 0.85W internal dissipation as a combiner allowing reliable operation without excessive

temperature rise. Similar splitters implemented as Wilkinson splitters on PCB require big resis-

tors and additional heat sinking.

As a splitter, EP2C+ can handle up to 1.85W in a very small package.

DC Passing up to 0.4A

DC current passing is helpful in applications where both RF & DC need to pass through the

DUT, such as antenna mounted hardware.

Small size

4 x 4mm QFN package

Tiny footprint saves space in dense layouts while providing low inductance, repeatable transi-

tions, and excellent thermal contact to the PCB.

The Big Deal

• Ultra-Wide Bandwidth, 1800-12500 MHz

• Tiny Size, 4 x 4 x 1 mm

• High Power Handling, 1.85W as a Splitter

2 Way-0°

50Ω

1800 to 12500 MHz

Key Features

EP2C+

CASE STYLE: DG1847