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TLV705, TLV705P

SBVS151F – DECEMBER 2010 – REVISED APRIL 2017

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Product Folder Links: TLV705 TLV705P

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Copyright © 2010–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ..................................... 5

6.2

ESD Ratings ............................................................ 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Typical Characteristics .............................................. 7

7

Detailed Description ............................................ 12

7.1

Overview ................................................................. 12

7.2

Functional Block Diagrams ..................................... 12

7.3

Feature Description................................................. 13

7.4

Device Functional Modes........................................ 14

8

Application and Implementation ........................ 15

8.1

Application Information............................................ 15

8.2

Typical Application .................................................. 15

8.3

Do's and Don'ts ....................................................... 16

9

Power Supply Recommendations ...................... 16

10

Layout................................................................... 17

10.1

Layout Guidelines ................................................. 17

10.2

Layout Example .................................................... 17

10.3

Power Dissipation ................................................. 17

10.4

Power Dissipation and Junction Temperature ...... 17

10.5

Estimating Junction Temperature ......................... 18

11

Device and Documentation Support ................. 19

11.1

Device Support .................................................... 19

11.2

Documentation Support ....................................... 19

11.3

Related Links ........................................................ 19

11.4

Community Resources.......................................... 20

11.5

Trademarks ........................................................... 20

11.6

Electrostatic Discharge Caution ............................ 20

11.7

Glossary ................................................................ 20

12

Mechanical, Packaging, and Orderable

Information ........................................................... 20

12.1

Package Mounting ................................................ 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision E (May 2015) to Revision F

Page

•

Deleted "x" from TLV705 device in document title ................................................................................................................ 1

•

Changed package dimensions in document title from "0.8-mm × 0.8-mm" to "0.77-mm × 0.77-mm" .................................. 1

•

Changed ultra-low profile maximum height from 0.2-mm to 0.15-mm in Applications section ............................................. 1

•

Changed package dimensions in Description section from 0.8-mm to 0.77-mm. .................................................................. 1

•

Changed DSBGA package dimensions from "0.80 mm × 0.80 mm" to "0.77 mm × 0.77 mm" in the Device

Information table .................................................................................................................................................................... 1

•

Added copyright statement to the Typical Application Circuit ............................................................................................... 1

•

Changed formatting of Thermal Information table note ......................................................................................................... 5

•

Deleted "x" from device number in Thermal Information table .............................................................................................. 5

•

Added copyright statement to functional block diagrams in Functional Block Diagrams section ........................................ 12

•

Added copyright statement to Typical Application Circuit (Fixed-Voltage Versions) in the Typical Application section ..... 15

•

Changed formatting of document reference in Related Documentation section ................................................................. 19

•

Changed table header title from "Sample & Buy" to "Order Now" in the Related Links table ............................................ 19

Changes from Revision D (April 2015) to Revision E

Page

•

Added new package (YFM) to document .............................................................................................................................. 1

•

Added PicoStar to title ........................................................................................................................................................... 1

•

Changed last Features bullet ................................................................................................................................................. 1

•

Changed last sentence of Description section ...................................................................................................................... 1

•

Added second row to Device Information table ..................................................................................................................... 1

•

Added YFM pin out drawing ................................................................................................................................................... 4

•

Added YFM package to Thermal Information table ............................................................................................................... 5

•