8

TLV9061, TLV9062, TLV9064

SBOS839B – MARCH 2017 – REVISED OCTOBER 2017

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

8.5 Thermal Information

TLV9062

UNIT

D (SOIC)

DGK (VSSOP)

DSG (WSON)

PW (TSSOP)

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal

resistance

157.6

201.2

94.4

205.8

°C/W

Junction-to-case(top) thermal

resistance

104.6

85.7

116.5

106.7

°C/W

Junction-to-board thermal

resistance

99.7

122.9

61.3

133.9

°C/W

Junction-to-top characterization

parameter

55.6

21.2

13

34.4

°C/W

Junction-to-board characterization

parameter

99.2

121.4

61.7

132.6

°C/W

Junction-to-case(bottom) thermal

resistance

N/A

N/A

34.4

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

8.6 Thermal Information: TLV9064

TLV9064

UNIT

PW (TSSOP)

D (SOIC)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

135.8

106.9

°C/W

Junction-to-case(top) thermal resistance

64

64

°C/W

Junction-to-board thermal resistance

79

63

°C/W

Junction-to-top characterization parameter

15.7

25.9

°C/W

Junction-to-board characterization parameter

78.4

62.7

°C/W