Document Number: 001-98296 Rev. *J

Page 10 of 19

S70GL02GS

3.2

LSH064—64 ball Fortified Ball Grid Array, 13 x 11 mm

Figure 5. LSH064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm

g1005.2 \ f16-038.15 \ 08.10.10

NOTES:

1.

DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JEP 95, SECTION 4.3, SPP-010.

4.

e REPRESENTS THE SOLDER BALL GRID PITCH.

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE

"D" DIRECTION.

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

6

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

7

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS

A AND B AND DEFINE THE POSITION OF THE CENTER

SOLDER BALL IN THE OUTER ROW.

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN

THE OUTER ROW SD OR SE = 0.000.

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN

THE OUTER ROW, SD OR SE = e/2

8. “+” INDICATES THE THEORETICAL CENTER OF DEPOPULATED BALLS.

9

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

PACKAGE

LSH 064

JEDEC

N/A

D X E

13.00 mm x 11.00 mm

PACKAGE

SYMBOL

MIN

NOM

MAX

NOTE

A

---

---

1.4

PROFILE

A1

0.40

---

---

BALL HEIGHT

D

13.00 BSC

BODY SIZE

E

11.00 BSC

BODY SIZE

D1

7.00 BSC

MATRIX FOOTPRINT

E1

7.00 BSC

MATRIX FOOTPRINT

MD

8

MATRIX SIZE D DIRECTION

ME

8

MATRIX SIZE E DIRECTION

n

64

BALL COUNT

b

0.50

0.60

0.70

BALL DIAMETER

eE

1.00 BSC

BALL PITCH

eD

1.00 BSC

BALL PITCH

SD / SE

0.50 BSC

SOLDER BALL PLACEMENT

DEPOPULATED SOLDER BALLS