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MPQ4485 Datasheet(PDF) 4 Page - Monolithic Power Systems |
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MPQ4485 Datasheet(HTML) 4 Page - Monolithic Power Systems |
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4 / 22 page ![]() MPQ4485 – STEP-DOWN CONVERTER WITH DUAL USB CHARGING PORTS MPQ4485 Rev.1.0 www.MonolithicPower.com 4 9/18/2017 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2017 MPS. All Rights Reserved. ABSOLUTE MAXIMUM RATINGS (1) Supply voltage (VIN) ..................... -0.4V to +40V VSW ...................................-0.3V (-5V for <10ns) to VIN + 0.3V (43V for <10ns) VBST ..................................................VSW + 5.5V VEN ..........................................-0.3V to +10V (2) VOUT, VUSB ...................................................................................... -0.3V to +6.5V All other pins............................... -0.3V to +5.5V Continuous power dissipation (TA = +25°C) (3) QFN-26 (5mmx5mm) ...............................6.25W Junction temperature ............................... 150°C Lead temperature .................................... 260°C Storage temperature................ -65°C to +150°C Recommended Operating Conditions (4) Operation input voltage range............ 6V to 36V Output current........3A for USB1, 2.5A for USB2 Operating junction temp. (TJ)... -40°C to +125°C Thermal Resistance θJA θJC QFN-26 (5mmx5mm) JESD51-7 (5) ......................... 44........ 9 .... °C/W 50mmx50mm 4-Layer PCB ... 20........ 2 .... °C/W NOTES: 1) Absolute maximum ratings are rated under room temperature unless otherwise noted. Exceeding these ratings may damage the device. 2) For details on EN ’s ABS max rating, please refer to the EN Control section on page 13. 3) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation produces an excessive die temperature, causing the regulator to go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. Measured on a 4-layer PCB (50mmx50mm). 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. |
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