LTC7124

20

7124fa

For more information www.linear.com/LTC7124

PACKAGE DESCRIPTION

3.00 ±0.10

0.50 BSC

1.50 REF

5.00 ±0.10

NOTE:

1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 5)

0.40 ±0.10

PIN 1 ID

0.50 ±0.10

1

8

13

20

21

24

9

12

BOTTOM VIEW—EXPOSED PAD

3.50 REF

0.80

0.40

0.75 ±0.05

R = 0.110

TYP

0.25 ±0.05

0.50 BSC

0.31

0.23

0.200 REF

0.00 – 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

0.70 ±0.05

0.25 ±0.05

3.50 REF

4.10 ±0.05

5.50 ±0.05

1.50 REF

2.10 ±0.05

3.50 ±0.05

PACKAGE OUTLINE

0.50 BSC

UDD Package

24-Lead Plastic QFN (3mm × 5mm)

(Reference LTC DWG # 05-08-1537 Rev Ø)

Exposed Pad Variation AA

(UDC24) QFN 0316 REV Ø

0.40

0.31

0.23

0.40

0.80

Please refer to http://www.linear.com/product/LTC7124#packaging for the most recent package drawings.