ESDA6V1-4F1

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ESDA6V1-4F1

The ESDA6V1-4F1 array is the ideal product for use as board level protection of ESD sensitive

semiconductor components.

The Flip Chip package makes the ESDA6V1-4F1 device some of the smallest ESD protection devices

available. It also allows design flexibility in the design of “crowded” boards where the space saving is at a

premium. This enables to shorten the routing and can contribute to improved ESD performance.

500µm

500µm

Ø =340µm min (for 300µm

pad

Non Solder mask opening

∅

Copper Pad

Cu - Ni (2-6µm) - Au (0.2µm max)

= 250µm (300µm max)

∅

Ø =320µm max (stencil aperture)

Solder paste

Stencil Design

thickness of 150µm

LAYOUT RECOMMENDATIONS

Circuit board layout is a critical design step in the suppression of ESD induced transients. The following

guidelines are recommended :

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The ESDA6V1-4F1 should be placed as close as possible to the input terminals or connectors.

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Minimise the path length between the ESD suppressor and the protected device

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Minimise all conductive loops, including power and ground loops

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The ESD transient return path to ground should be kept as short as possible.

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Use ground planes whenever possible.