LTM4623 datasheet(20/28 Pages) LINER

20 / 28 page

LTM4623

4623fc

For more information www.linear.com/LTM4623

applicaTions inForMaTion

Table 7. Output Voltage Response vs Component Matrix (Refer to Figure 24)

CIN

PART NUMBER

VALUE

COUT1

PART NUMBER

VALUE

Murata

GRM21BR61E106KA73L

10µF, 25V, 0805, X5R

Murata

GRM21BR60J476ME15

47µF, 6.3V, 0805, X5R

Taiyo Yuden

TMK212BBJ106KG-T

10µF, 25V, 0805, X5R

Taiyo Yuden

JMK212BJ476MG-T

47µF, 6.3V, 0805, X5R

Murata

GRM31CR61C226ME15L

22µF, 25V, 1206, X5R

Taiyo Yuden

TMK316BBJ226ML-T

22µF, 25V, 1206, X5R

VOUT

(V)

CIN

(CERAMIC)

(µF)

COUT1

(CERAMIC)

(µF)

CFF

(pF)

VIN

(V)

DROOP

(mV)

P-P DERIVATION

(mV)

RECOVERY

TIME (µs)

LOAD

STEP (A)

LOAD STEP

SLEW RATE

(A/µs)

RFB

(kΩ)

FREQ

(MHz)

100

5, 12

90.9

1.2

100

5, 12

60.4

1.5

100

5, 12

40.2

1.8

100

5, 12

30.1

2.5

100

5, 12

108

19.1

3.3

100

5, 12

111

13.3

100

156

8.25k

Safety Considerations

The LTM4623 modules do not provide galvanic isolation

from VIN to VOUT. There is no internal fuse. If required,

a slow blow fuse with a rating twice the maximum input

current needs to be provided to protect each unit from

catastrophic failure. The device does support thermal

shutdown and overcurrent protection.

Layout Checklist/Example

The high integration of LTM4623 makes the PCB board

layoutverysimpleandeasy.However,tooptimizeitselectri-

cal and thermal performance, some layout considerations

are still necessary.

• Use large PCB copper areas for high current paths,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, PGND and VOUT pins to minimize

high frequency noise.

• Placeadedicatedpowergroundlayerunderneaththeunit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put via directly on the pad, unless they are

capped or plated over.

Table 5. 3.3V Output, No Heat Sink

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIR FLOW (LFM)

HEAT SINK

θJA(°C/W)

Figures 18, 19, 20

5, 12, 16

Figure 10

None

Figures 18, 19, 20

5, 12, 16

Figure 10

200

None

Figures 18, 19, 20

5, 12, 16

Figure 10

400

None

Table 6. 5V Output, No Heat Sink

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIR FLOW (LFM)

HEAT SINK

θJA(°C/W)

Figures 21, 22

12, 16

Figure 11

None

Figures 21, 22

12, 16

Figure 11

200

None

Figures 21, 22

12, 16

Figure 11

400

None

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