Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product

descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no

liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement

of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended

to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to

discontinue or make changes to its products at any time without notice.

Specification: DS-LIA120-R02.0

©Copyright 2005, Clare, Inc.

All rights reserved. Printed in USA.

2/17/05

For additional information please visit our website at: www.clare.com

MECHANICAL DIMENSIONS

PC Board Pattern

(Top View)

Dimensions:

mm

(inches)

Tape and Reel Packaging for 8 Pin Surface Mount Package

K0 = 4.90

(0.193)

K1 = 4.20

(0.165)

Top Cover

Tape

P = 12.00

(0.472)

User Direction of Feed

NOTE: Tape dimensions not shown, comply with JEDEC Standard EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004)

330.2 DIA.

(13.00)

A

(0.406)

B

(0.406)

W = 16.30 max

(0.642 max)

8 Pin Surface Mount (“S” Suffix)