MBR3045C

Document number: DS36957 Rev. 4 - 2

4 of 7

www.diodes.com

February 2017

© Diodes Incorporated

MBR3045C

Thermal Characteristics

Characteristic

Symbol

Rating

Unit

Maximum Thermal Resistance (Junction to Case)

(Note 8)

TO-220-3 (2)

2.0

°C/W

TO-220F-3 (Option 1)

4.0

Maximum Thermal Resistance (Junction to Ambient)

(Note 8)

TO-220-3 (2)

15

TO-220F-3 (Option 1)

25

Note 8:

Device mounted on heat sink, with minimum recommended pad layout per http://www.diodes.com/package-outlines.html.

Characteristic

Symbol

Rating

Unit

Test Condition

Maximum Instantaneous Forward Voltage Drop

(Note 9)

0.7

V

0.57

Maximum Instantaneous Reverse Current

(Note 9)

20

mA

0.1

Note 9:

Short duration pulse test used to minimize self-heating effect, Pulse Test Width = 300µs, Duty Cycle < 2.0%.

Figure 1. Typical Forward Voltage

Figure 2. Typical Reverse Current

Figure 3. Average Rectified Forward Current vs.

Case Temperature (Each Diode)

0.01

0.1

1

10

100

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

V

F

, Instantaneous Forward Voltage (V)

25

125

150

0

20

40

0.1

1

10

100

1000

10000

100000

V

R

, Reverse Voltage (V)

25

125

150

100

105

110

115

120

125

130

135

140

145

150

155

160

0

2

4

6

8

10

12

14

16

18

20

22

24

26

28

Note 8

T

C

, Case Temperature (