Revision Date: 11/29/04

Aeroflex / Metelics

Aeroflex Microelectronic Solutions

975 Stewart Drive, Sunnyvale, CA 94085

TEL: 408-737-8181

Fax: 408-733-7645

www.aeroflex-metelics.com

sales@aeroflex-metelics.com

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and services herein at any time without notice. Consult Aeroflex or an

authorized sales representative to verify that the information in this data

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Copyright 2003 Aeroflex / Metelics. All rights reserved.

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MMA709

2 Watt InGaP HBT Amplifier

3030 Package Outline:

Figure 13.

Figure 14.

SOIC8 Package Outline:

SEATING PLANE

MMA

709

TERMINAL #1

IDENTIFIER

4

3

2

1

8

7

6

5

45° INDEX CHAMFER

0.238±0.008

0.154±0.003

0.002±0.002

0.053±0.003

0.050 BSC

0.016±0.001 8X

3°+5°-3°

0.020±0.004

0.008±0.001

EXPOSED PAD

PIN

CONNECTION

2, 3

RF INPUT &

BASE BIAS

6, 7

RF OUTPUT &

COLLECTOR BIAS

1, 4, 5, 8

NC

0.195±0.003

5

0

0

.

0

±

8

1

1

.

0

3

6

0

.

0

5

0

0

.

0

±

9

0

0

.

0

4

0

.

0

5

0

0

.

0

±

7

1

0

.

0

2

1

0

.

0

5

0

0

.

0

±

8

2

0

.

0

2

5

0

0

.

0

±

5

1

0

.

0

1

N

I

P

R

E

K

R

A

M

1

N

I

P

)

X

A

M

(

5

3

0

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0

8

0

0

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0

:

D

E

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F

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I

W

R

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H

T

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S

S

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L

N

U

S

E

H

C

N

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N

I

S

N

O

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S

N

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M

I

D

.

1

"

1

0

0

.

0

-

/

+

S

N

O

I

S

N

E

M

I

D

L

L

A

.

2

N

O

I

T

C

E

N

N

O

C

N

I

P

C

/

N

8

,

5

,

4

,

1

D

N

A

T

U

P

N

I

F

R

3

,

2

S

A

I

B

E

S

A

B

T

U

P

T

U

O

F

R

7

,

6

S

A

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B

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O

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1

3

2

4

5

6

7

8

A

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M

9

0

7

9

9

0

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0

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0

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0

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8

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.

0