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MMRF1304LR5 Datasheet(PDF) 2 Page - NXP Semiconductors |
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MMRF1304LR5 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 12 page ![]() 2 RF Device Data Freescale Semiconductor, Inc. MMRF1304LR5 Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS --0.5, +133 Vdc Gate--Source Voltage VGS --6.0, +10 Vdc Storage Temperature Range Tstg --65 to +150 C Case Operating Temperature Range TC --40 to +150 C Operating Junction Temperature Range (1,2) TJ --40 to +225 C Table 2. Thermal Characteristics Characteristic Symbol Value (2) Unit Thermal Resistance, Junction to Case CW: Case Temperature 81C, 25 W CW, 50 Vdc, IDQ = 10 mA, 512 MHz RJC 1.4 C/W Thermal Impedance, Junction to Case Pulse: Case Temperature 77C, 25 W Peak, 100 sec Pulse Width, 20% Duty Cycle, 50 Vdc, IDQ = 10 mA, 512 MHz ZJC 0.32 C/W Table 3. ESD Protection Characteristics Test Methodology Class Human Body Model (per JESD22--A114) 2, passes 2000 V Machine Model (per EIA/JESD22--A115) B, passes 200 V Charge Device Model (per JESD22--C101) IV, passes 1200 V Table 4. Electrical Characteristics (TA =25C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Off Characteristics Gate--Source Leakage Current (VGS =5 Vdc, VDS =0 Vdc) IGSS — — 400 nAdc Drain--Source Breakdown Voltage (VGS =0 Vdc, ID =50 mA) V(BR)DSS 133 140 — Vdc Zero Gate Voltage Drain Leakage Current (VDS =50 Vdc, VGS =0 Vdc) IDSS — — 2 Adc Zero Gate Voltage Drain Leakage Current (VDS = 100 Vdc, VGS =0 Vdc) IDSS — — 7 Adc On Characteristics Gate Threshold Voltage (VDS =10 Vdc, ID =85 Adc) VGS(th) 1.5 2.0 2.5 Vdc Gate Quiescent Voltage (VDD =50 Vdc, ID = 10 mAdc, Measured in Functional Test) VGS(Q) 2.0 2.4 3.0 Vdc Drain--Source On--Voltage (VGS =10 Vdc, ID = 210 mAdc) VDS(on) — 0.23 — Vdc Dynamic Characteristics Reverse Transfer Capacitance (VDS =50 Vdc 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc) Crss — 0.17 — pF Output Capacitance (VDS =50 Vdc 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc) Coss — 14.7 — pF Input Capacitance (VDS =50 Vdc, VGS =0 Vdc 30 mV(rms)ac @ 1 MHz) Ciss — 39.0 — pF 1. Continuous use at maximum temperature will affect MTTF. 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955. (continued) |
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