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SSM4567ACBZ-R7 Datasheet(PDF) 52 Page - Analog Devices |
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SSM4567ACBZ-R7 Datasheet(HTML) 52 Page - Analog Devices |
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52 / 52 page ![]() SSM4567 Data Sheet Rev. 0| Page 52 of 52 OUTLINE DIMENSIONS Figure 58. 19-Ball Wafer Level Chip Scale Package [WLCSP] (CB-19-1) Dimensions shown in millimeters ORDERING GUIDE Model1 Temperature Range Package Description Package Option SSM4567ACBZ-R7 −40°C to +85°C 19-Ball WLCSP CB-19-1 SSM4567ACBZ-RL −40°C to +85°C 19-Ball WLCSP CB-19-1 EVAL-SSM4567Z Evaluation Board EVAL-SSM4567MINIZ Evaluation Board 1 Z = RoHS Compliant Part. I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors). A B C D E 2.140 2.100 2.060 1.780 1.740 1.700 1 2 3 4 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) BALL A1 IDENTIFIER 0.40 BSC 0.560 0.500 0.440 SIDE VIEW 0.230 0.200 0.170 0.300 0.260 0.220 1.60 REF 1.20 REF COPLANARITY 0.05 SEATING PLANE ©2014 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12278-0-4/14(0) |
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