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TLV9064IPWR Datasheet(PDF) 13 Page - Texas Instruments |
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TLV9064IPWR Datasheet(HTML) 13 Page - Texas Instruments |
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13 / 62 page ![]() 13 TLV9061, TLV9062S, TLV9062, TLV9064, TLV9064S www.ti.com SBOS839E – MARCH 2017 – REVISED JULY 2018 Product Folder Links: TLV9061 TLV9062S TLV9062 TLV9064 TLV9064S Submit Documentation Feedback Copyright © 2017–2018, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 8.4 Thermal Information: TLV9061 THERMAL METRIC(1) TLV9061 UNIT DBV (SOT-23) DCK (SC70) DPW (X2SON) 5/6 PINS 5 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 221.7 263.3 467 °C/W RθJC(top) Junction-to-case(top) thermal resistance 144.7 75.5 211.6 °C/W RθJB Junction-to-board thermal resistance 49.7 51 332.2 °C/W ψJT Junction-to-top characterization parameter 26.1 1 29.3 °C/W ψJB Junction-to-board characterization parameter 49 50.3 330.6 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A 125 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 8.5 Thermal Information: TLV9062 THERMAL METRIC(1) TLV9062 UNIT D (SOIC) DGK (VSSOP) DSG (WSON) PW (TSSOP) 8 PINS 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 157.6 201.2 94.4 205.8 °C/W RθJC(top) Junction-to-case(top) thermal resistance 104.6 85.7 116.5 106.7 °C/W RθJB Junction-to-board thermal resistance 99.7 122.9 61.3 133.9 °C/W ψJT Junction-to-top characterization parameter 55.6 21.2 13 34.4 °C/W ψJB Junction-to-board characterization parameter 99.2 121.4 61.7 132.6 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A 34.4 N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 8.6 Thermal Information: TLV9062S THERMAL METRIC(1) TLV9062S UNIT DGS (VSSOP) 10 PINS RθJA Junction-to-ambient thermal resistance 170.4 °C/W RθJC(top) Junction-to-case(top) thermal resistance 84.9 °C/W RθJB Junction-to-board thermal resistance 113.5 °C/W ψJT Junction-to-top characterization parameter 16.4 °C/W ψJB Junction-to-board characterization parameter 112.3 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 8.7 Thermal Information: TLV9064 THERMAL METRIC(1) TLV9064 UNIT PW (TSSOP) D (SOIC) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 135.8 106.9 °C/W RθJC(top) Junction-to-case(top) thermal resistance 64 64 °C/W |
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