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TLV9064IPWR Datasheet(PDF) 13 Page - Texas Instruments

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Part # TLV9064IPWR
Description  10-MHz, RRIO, CMOS Operational Amplifiers for Cost-Sensitive Systems
PDF  62 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TLV9064IPWR Datasheet(HTML) 13 Page - Texas Instruments

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TLV9061, TLV9062S, TLV9062, TLV9064, TLV9064S
www.ti.com
SBOS839E – MARCH 2017 – REVISED JULY 2018
Product Folder Links: TLV9061 TLV9062S TLV9062 TLV9064 TLV9064S
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Copyright © 2017–2018, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
8.4 Thermal Information: TLV9061
THERMAL METRIC(1)
TLV9061
UNIT
DBV (SOT-23)
DCK (SC70)
DPW (X2SON)
5/6 PINS
5 PINS
5 PINS
RθJA
Junction-to-ambient thermal resistance
221.7
263.3
467
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
144.7
75.5
211.6
°C/W
RθJB
Junction-to-board thermal resistance
49.7
51
332.2
°C/W
ψJT
Junction-to-top characterization parameter
26.1
1
29.3
°C/W
ψJB
Junction-to-board characterization parameter
49
50.3
330.6
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
N/A
125
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
8.5 Thermal Information: TLV9062
THERMAL METRIC(1)
TLV9062
UNIT
D (SOIC)
DGK (VSSOP)
DSG (WSON)
PW (TSSOP)
8 PINS
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal
resistance
157.6
201.2
94.4
205.8
°C/W
RθJC(top)
Junction-to-case(top) thermal
resistance
104.6
85.7
116.5
106.7
°C/W
RθJB
Junction-to-board thermal
resistance
99.7
122.9
61.3
133.9
°C/W
ψJT
Junction-to-top characterization
parameter
55.6
21.2
13
34.4
°C/W
ψJB
Junction-to-board characterization
parameter
99.2
121.4
61.7
132.6
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal
resistance
N/A
N/A
34.4
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
8.6 Thermal Information: TLV9062S
THERMAL METRIC(1)
TLV9062S
UNIT
DGS (VSSOP)
10 PINS
RθJA
Junction-to-ambient thermal resistance
170.4
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
84.9
°C/W
RθJB
Junction-to-board thermal resistance
113.5
°C/W
ψJT
Junction-to-top characterization parameter
16.4
°C/W
ψJB
Junction-to-board characterization parameter
112.3
°C/W
RθJC(bot)
Junction-to-case(bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
8.7 Thermal Information: TLV9064
THERMAL METRIC(1)
TLV9064
UNIT
PW (TSSOP)
D (SOIC)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
135.8
106.9
°C/W
RθJC(top)
Junction-to-case(top) thermal resistance
64
64
°C/W



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