SLDM-12D1Ax

49

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Rev. AC

SURFACE MOUNT INFORMATION(CONTINUED)

Storage and Handling

The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-

033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB)

with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the

original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL

rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when

stored at the following conditions: < 40° C, < 90% relative humidity.

Figure51

Recommended linear reflow profile using Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning

and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on

appropriate soldering, cleaning and drying procedures, refer to Board Mounted Power Modules: Soldering and Cleaning Application Note

(AN04-001).

Per J-STD-020 Rev. D

0

50

100

150

200

250

300

Reflow Time (Seconds)

Reflow Temp (°C)

Heating Zone

1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C

15 Seconds

*Time Above 217°C

60 Seconds

Cooling

Zone