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ADV7482WBBCZ Datasheet(PDF) 12 Page - Analog Devices

Part # ADV7482WBBCZ
Description  Integrated Video Decoder and HDMI Receiver
PDF  20 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADV7482WBBCZ Datasheet(HTML) 12 Page - Analog Devices

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ADV7482
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
TVDD, DVDDIO to GND
4 V
AVDD, PVDD, MVDD, DVDD, CVDD
to GND
2.2 V
CVDD to DVDD
−0.3 V to +0.3 V
MVDD to DVDD
−0.3 V to +0.3 V
PVDD to DVDD
−0.3 V to +0.3 V
AVDD to DVDD
−0.3 V to +0.3 V
Digital Inputs Voltage to GND
GND − 0.3 V to DVDDIO +
0.3 V
Digital Outputs Voltage to GND
GND − 0.3 V to DVDDIO +
0.3 V
Analog Inputs to GND
−0.3 V to AVDD + 0.3 V
XTALN and XTALP to GND
−0.3 V to PVDD + 0.3 V
HDMI Digital Inputs Voltage to
GND
−0.3 V to CVDD + 0.3 V
5 V Tolerant Inputs Voltage to
GND1, 2
−0.3 V to +5.5 V
Maximum Junction Temperature
(TJ max)
125°C
Storage Temperature Range
−65°C to +150°C
Infrared Reflow Soldering
(20 sec)
260°C
1
The following inputs are 3.3 V inputs but are 5 V tolerant: DDC_SCL,
DDC_SDA, HPD, RX_5V, and CEC.
2
The following inputs are 1.8 V inputs but are 5 V tolerant: DIAG1, DIAG2,
DIAG3, and DIAG4.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
To reduce power consumption when using the ADV7482, turn
off unused sections of the device.
Due to printed circuit board (PCB) metal variation, and,
therefore, variation in PCB heat conductivity, the value of θJA
may differ for various PCBs.
The most efficient measurement solution is achieved using the
package surface temperature to estimate the die temperature.
This eliminates the variance associated with the θJA value.
Do not exceed the maximum junction temperature (TJ max) of
125°C. The following equation calculates the junction
temperature (TJ) using the measured package surface
temperature and applies only when no heat sink is used on the
device under test (DUT):
TJ = TS + (ΨJT ×WTOTAL)
where:
TS is the package surface temperature (°C).
ΨJT = 0.81°C/W for the 100-ball CSP_BGA (based on 2s2p test
board defined by JEDEC standards.
WTOTAL = (PVDD × IPVDD) + (TVDD × ITVDD) − PUpStream +
(CVDD × ICVDD) + (AVDD × IAVDD) + (DVDD × IDVDD) +
(DVDDIO × IDVDDIO) + (MVDD × IMVDD)
where PUpStream is the quantity of TVDD power consumed on the
upstream HDMI transmitter. PUpStream can be estimated to be
around 110 mW for a nominal HDMI transmitter.
ESD CAUTION
Rev. 0 | Page 12 of 20



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