AD5142ABCPZ100-RL7 datasheet(11/32 Pages) AD

11 / 32 page

Data Sheet

AD5122A/AD5142A

Rev. B | Page 11 of 32

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 5.

Parameter

Rating

DD to GND

−0.3 V to +7.0 V

SS to GND

+0.3 V to −7.0 V

DD to VSS

7 V

LOGIC to GND

−0.3 V to V

DD + 0.3 V or

+7.0 V (whichever is less)

A, VW, VB to GND

SS − 0.3 V, VDD + 0.3 V

+7.0 V (whichever is less)

A, IW, IB

Pulsed1

Frequency > 10 kHz

AW = 10 kΩ

±6 mA/d2

AW = 100 kΩ

±1.5 mA/d2

Frequency ≤ 10 kHz

AW = 10 kΩ

±6 mA/√d2

AW = 100 kΩ

±1.5 mA/√d2

Digital Inputs

−0.3 V to V

LOGIC + 0.3 V or

+7 V (whichever is less)

Operating Temperature Range, T

−40°C to +125°C

Maximum Junction Temperature,

J Maximum

150°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Package Power Dissipation

J max − TA)/θJA

FICDM

1.5 kV

1 Maximum terminal current is bounded by the maximum current handling of

the switches, maximum power dissipation of the package, and maximum

applied voltage across any two of the A, B, and W terminals at a given

resistance.

2 d = pulse duty factor.

3 Includes programming of EEPROM memory.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is defined by the JEDEC JESD51 standard, and the value is

dependent on the test board and test environment.

Table 6. Thermal Resistance

Package Type

Unit

16-Lead LFCSP

89.51

°C/W

16-Lead TSSOP

150.41

27.6

°C/W

1 JEDEC 2S2P test board, still air (0 m/sec airflow).

ESD CAUTION

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