NICHIA STS-DA1-3555F <Cat.No.180925>

9

SOLDERING

• Recommended Reflow Soldering Condition(Lead-free Solder)

120sec Max

Pre-heat

180 to 200°C

260°CMax

10sec Max

60sec Max

Above 220°C

1 to 5°C per sec

● Recommended Soldering Pad Pattern

(単位 Unit: mm)

0.5

0.4

0.5

4.1

1.3

* This LED is designed to be reflow soldered to a PCB. If dip soldered or hand soldered, Nichia will not guarantee its reliability.

* Reflow soldering must not be performed more than twice.

* When cooling the LEDs from the peak temperature a gradual cooling slope is recommended; do not cool the LEDs rapidly.

* During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular,

reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if a

nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.

* This LED uses a silicone resin for the lens and internal pre-coating resin; the silicone resin is soft. If pressure is applied to the lens,

it may cause the lens to be damaged, chipped, and/or delaminated. If the resin is damaged, chipped, delaminated and/or

deformed, it may cause the internal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate) and/or

reliability issues (e.g. the LED to corrode and/or to become dimmer, the color/directivity to change, etc.). Ensure that pressure

is not applied to the lens.

If an automatic pick and place machine is used for the LEDs, use a pick up nozzle that does not affect the lens.

Recommended conditions:

Using a nozzle specifically designed for the LEDs is recommended (See the nozzle drawing below).

* Ensure that the nozzle does not come in contact with the lens when it picks up an LED.

If this occurs, it may cause internal disconnection causing the LED not to illuminate.

(単位 Unit: mm)

A部大

Expansion of A

0.15

4.5

A

Φ3.5