12

LTC4413

4413f

© LINEAR TECHNOLOGY CORPORATION 2004

LT/TP 1104 1K • PRINTED IN THE USA

PART NUMBER

DESCRIPTION

COMMENTS

LTC1558/LTC1559

Backup Battery Controller with Programmable

Adjustable Backup Voltage from 1.2V NiCd Button Cell, Includes Boost Converter

Output

LTC1998

2.5µA, 1% Accurate Programmable Battery

Adjustable Trip Voltage/Hysteresis, ThinSOT

TM

Detector

LTC4054

800mA Standalone Linear Li-Ion Battery

No External MOSFET, Sense Resistor or Blocking Diode Required, Charge Current

Charger with Thermal Regulation in ThinSOT

Monitor for Gas Gauging, C/10 Charge Termination

LTC4055

USB Power Controller and Li-Ion Charger

Automatic Switchover, Charges 1-Cell Li-Ion Batteries

LTC4350

Hot Swappable Load Share Controller

Allows N + 1 Redundant Supply, Equally Loads Multiple Power Supplies

Connected in Parallel

LTC4351

MOSFET Diode-OR Controller

1.2V to 18V Input, Internal Boost Regulator for Driving N-Channel MOSFET

LTC4411

2.6A Low Loss Ideal Diode in ThinSOT

No External MOSFET, Automatic Switching Between DC Sources, Simplified

Load Sharing

LTC4412/LTC4412HV PowerPath Controllers in ThinSOT

More Efficient than Diode ORing, Automatic Switching Between DC Sources,

ThinSOT is a trademark of Linear Technology Corporation.

RELATED PARTS

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

PACKAGE DESCRIPTIO

DD Package

10-Lead Plastic DFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1699)

3.00 ±0.10

(4 SIDES)

NOTE:

1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).

CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT

2. ALL DIMENSIONS ARE IN MILLIMETERS

3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

0.38 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65 ± 0.10

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

2.38 ±0.10

(2 SIDES)

1

5

10

6

PIN 1

TOP MARK

(SEE NOTE 5)

0.200 REF

0.00 – 0.05

(DD10) DFN 0403

0.25 ± 0.05

2.38 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65 ±0.05

(2 SIDES)

2.15 ±0.05

0.50

BSC

0.675 ±0.05

3.50 ±0.05

PACKAGE

OUTLINE

0.25 ± 0.05

0.50 BSC

4. EXPOSED PAD SHALL BE SOLDER PLATED

5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE