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NCSW170DT Datasheet(PDF) 7 Page - NICHIA CORPORATION

Part # NCSW170DT
Description  WHITE LED
PDF  19 Pages
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Manufacturer  NICHIA [NICHIA CORPORATION]
Direct Link  http://www.nichia.co.jp
Logo NICHIA - NICHIA CORPORATION

NCSW170DT Datasheet(HTML) 7 Page - NICHIA CORPORATION

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NICHIA STS-DA1-5069A <Cat.No.180827>
6
* This LED uses ceramics for the phosphor sheet (i.e. emitting surface); if excess pressure is applied to the ceramics, it may cause
the ceramics to be damaged, chipped, cracked and/or deformed. If the ceramics is damaged, chipped, cracked and/or deformed,
it may cause the internal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate) and/or reliability issues
(e.g. the LED to corrode and/or to become dimmer, the color/directivity to change, etc.).
Recommended conditions:
Using a nozzle specifically designed for the LEDs is recommended (See the nozzle drawing below).
Nozzle contact area:
The center of the phosphor sheet (See the second figure from the right)
(単位 Unit: mm)
1.2
0.4
2.2
R0.1
If the nozzle is off-center and makes contact with the edges of the phosphor sheet (as shown in the figure to the right), it may
cause the ceramic to chip/crack.
Placement pressure ≤ 3.5N/mm2 *max. force: 5N
Vacuum pressure ≤ 8N/cm2 (≤ 0.8kgf/cm2)
* Once the LEDs have been soldered to a PCB, it should not be repaired/reworked. If it must be done, using a hot plate is strongly
recommended. Sufficient verification should be performed prior to use to ensure that the repair/rework does not cause the LED
characteristics to deteriorate.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product.
* The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision
is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the
flux will come in contact with the LEDs.
* Ensure that there are no issues with the type and amount of solder that is being used.
* This LED has all the electrodes on the backside; solder connections will not be able to be seen nor confirmed by a normal visual
inspection. Ensure that sufficient verification is performed on the soldering conditions prior to use to ensure that there are no
issues.



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