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F1421 Datasheet(PDF) 2 Page - Integrated Device Technology

Part # F1421
Description  RF Amplifier
PDF  16 Pages
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Manufacturer  IDT [Integrated Device Technology]
Direct Link  http://www.idt.com
Logo IDT - Integrated Device Technology

F1421 Datasheet(HTML) 2 Page - Integrated Device Technology

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© 2018 Integrated Device Technology, Inc.
2
Rev O May 11, 2018
F1421 Datasheet
Pin Assignments
Figure 2.
Pin Assignments for 4mm x 4mm x 0.9mm QFN Package
– Top View
NC
NC
NC
NC
NC
NC
NC
NC
GND
GND
RFOUT
NC
EPAD
1
2
3
4
5
6
13
14
15
16
17
18
Control Circuit
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1 - 7, 12,
16 - 20, 24
NC
No internal connection. These pins can be left unconnected, have a voltage applied, or be connected to
ground (recommended).
8
STBY
Standby (HIGH = device power OFF, LOW/Open = device power ON). Internally this pin has a pull-down
resistor that is connected to GND.
9
RSET
Amplifier bias current setting resistor. Connect a
2.26kΩ resistor to ground.
10
RDSET
Amplifier second bias current setting resistor. Connect a
5.76kΩ resistor to ground.
11
VCC
Power supply for the amplifier.
13, 15, 21,
23
GND
Internally grounded. These pins must be grounded as close to the device as possible.
14
RFOUT
RF output. Must use an external DC block as close to the pin as possible.
22
RFIN
RF input internally matched to 50Ω. Must use an external DC block. The DC block should be placed as
close to the pin as possible for best RF performance.
– EPAD
Exposed paddle. Internally connected to ground. Solder this exposed paddle to a printed circuit board
(PCB) pad that uses multiple ground vias to provide heat transfer out of the device into the PCB ground
planes. These multiple ground vias are also required to achieve the specified RF performance.



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