FS8205 datasheet(4/6 Pages) FORTUNE

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FS8205

Thermal Data

Symbol

Parameter

Value

Unit

Rthj-a

Thermal Resistance Junction-ambient3

Max. 125

℃

Electrical Characteristics

Electrical Characteristics @Tj = 25℃ ( unless otherwise specified )

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Static Characteristics

BVDSS

Drain-Source Breakdown Voltage

VGS = 0V, ID = 250uA

BVDSS/ΔTj

Breakdown Voltage Temperature Coefficient

Reference to 25℃, ID=1mA

0.1

V/℃

RDS(ON)

Static Drain-Source On-Resistance

VGS = 4.5V, ID = 4A

mΩ

VGS = 2.5V, ID = 3A

mΩ

VGS(th)

Gate Threshold Voltage

VDS = VGS, ID = 250uA

0.45

1.2

IDSS

Drain-Source Leakage Current (Tj = 25℃)

VDS =16V, VGS = 0V

Drain-Source Leakage Current (Tj = 70℃)

VDS =16V, VGS = 0V

IGSS

Gate-Source Leakage

VGS = ±10V

0.1

Source-Drain Diode

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Continuous Source Current (Body Diode)

VD = VG = 0V, VS = 1.2V

0.83

VSD

Forward On Voltage

Tj = 25℃, IS = 1.25A, VGS = 0V

1.2

Notes：

1. Pulse width limited by Max. junction temperature.

2. Pulse width ≦ 300us, duty cycle ≦ 2%.

3. Surface mounted on 1 in

2 copper pad of FR4 board；208℃/W when mounted on Min. copper

pad.

Rev. 1.9

4/4

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