TO-220FP datasheet(4/6 Pages) HSMC

4 / 6 page

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : MOS200402

Issued Date : 2004.04.01

Revised Date : 2005.03.10

Page No. : 4/6

H06N60U, H06N60E, H06N60F

HSMC Product Specification

TO-220AB Dimension

TO-220FP Dimension

Tab

Marking:

Control Code

Date Code

Pb Free Mark

Pb-Free: "

. " (Note)

Normal: None

N6 0

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2 & Tab.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-220AB

Plastic Package

HSMC Package Code: E

DIM

Min.

Max.

5.58

7.49

8.38

8.90

4.40

4.70

1.15

1.39

0.35

0.60

2.03

2.92

9.66

10.28

*16.25

I-

*3.83

3.00

4.00

0.75

0.95

2.54

3.42

1.14

1.40

N-

*2.54

12.70

14.27

14.48

15.87

*: Typical, Unit: mm

Marking:

Control Code

Date Code

Pb Free Mark

Pb-Free: "

. " (Note)

Normal: None

N6 0

Note: Green label is used for pb-free packing

Pin Style: 1.Gate 2.Drain 3.Source

Material:

• Lead solder plating: Sn60/Pb40 (Normal),

Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)

• Mold Compound: Epoxy resin family,

flammability solid burning class: UL94V-0

3-Lead TO-220FP

Plastic Package

HSMC Package Code: F

α3

α2

α4

α5

α1

DIM

Min.

Max.

6.48

7.40

4.40

4.90

2.34

3.00

0.45

0.80

9.80

10.36

3.10

3.60

2.70

3.43

0.60

1.00

2.34

2.74

12.48

13.60

15.67

16.20

0.90

1.47

2.00

2.96

α1/2/4/5

-*5o

α3

-*27o

*: Typical, Unit: mm

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