STR-A6000MZ datasheet(20/26 Pages) SANKEN

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STR-A6000MZ/HZ Series

STR-A6000MZ/HZ - DS Rev.1.2

SANKEN ELECTRIC CO.,LTD.

Mar.13, 2015

Margin tape

P1 S1 P2 S2 D

P1 S1

D S2 S1 P2

Winding structural example (a)

Winding structural example (b)

Figure 10-4 Winding structural examples

10.2 PCB Trace Layout and Component

Placement

Since the PCB circuit trace design and the component

layout significantly affects operation, EMI noise, and

power dissipation, the high frequency PCB trace should be

low impedance with small loop and wide trace.

In addition, the ground traces affect radiated EMI noise,

and wide, short traces should be taken into account.

Figure 10-5 shows the circuit design example.

(1) Main Circuit Trace Layout

This is the main trace containing switching currents,

and thus it should be as wide trace and small loop as

possible.

If C1 and the IC are distant from each other, placing

a capacitor such as film capacitor (about 0.1 μF and

with proper voltage rating) close to the transformer or

the IC is recommended to reduce impedance of the

high frequency current loop.

(2) Control Ground Trace Layout

Since the operation of the IC may be affected from

the large current of the main trace that flows in

control ground trace, the control ground trace should

be separated from main trace and connected at a

single point grounding of the point A in

Figure 10-5

as close to the ROCP pin as possible.

(3) VCC Trace Layout:

This is the trace for supplying power to the IC, and

thus it should be as small loop as possible. If C2 and

the IC are distant from each other, placing a capacitor

such as film capacitor Cf (about 0.1 μF to 1.0 μF)

close to the VCC pin and the GND pin is

recommended.

(4) ROCP Trace Layout

ROCP should be placed as close as possible to the

S/OCP pin. The connection between the power

ground of the main trace and the IC ground should be

at a single point ground (point A in

Figure 10-5)

which is close to the base of ROCP.

(5) Peripheral components of the IC

The components for control connected to the IC

should be placed as close as possible to the IC, and

should be connected as short as possible to the each

pin.

(6) Secondary Rectifier Smoothing Circuit Trace Layout:

This is the trace of the rectifier smoothing loop,

carrying the switching current, and thus it should be

as wide trace and small loop as possible. If this trace

is thin and long, inductance resulting from the loop

may increase surge voltage at turning off a power

MOSFET. Proper rectifier smoothing trace layout

helps to increase margin against the power MOSFET

breakdown voltage, and reduces stress on the clamp

snubber circuit and losses in it.

(7) Thermal Considerations

Because the power MOSFET has a positive thermal

coefficient of RDS(ON), consider it in thermal design.

Since the copper area under the IC and the D/ST pin

trace act as a heatsink, its traces should be as wide as

possible.

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