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TMS320DM643 Datasheet(PDF) 153 Page - Texas Instruments |
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TMS320DM643 Datasheet(HTML) 153 Page - Texas Instruments |
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153 / 160 page ![]() www.ti.com 7 Mechanical Data 7.1 Thermal Data TMS320DM643 Video/Imaging Fixed-Point Digital Signal Processor SPRS269A – FEBRUARY 2005 – REVISED APRIL 2005 The following table(s) show the thermal resistance characteristics for the PBGA – GDK, GNZ, ZDK, and ZNZ mechanical packages. Table 7-1. Thermal Resistance Characteristics (S-PBGA Package) [GDK] NO. °C/W AIR FLOW (m/s)(1) 1 R Θ JC Junction-to-case 3.3 N/A 2 R Θ JB Junction-to-board 7.92 N/A 3 18.2 0.00 4 15.3 0.5 R Θ JA Junction-to-free air 5 13.7 1.0 6 12.2 2.00 7 0.37 0.00 8 0.47 0.5 PsiJT Junction-to-package top 9 0.57 1.0 10 0.7 2.00 11 11.4 0.00 12 11 0.5 PsiJB Junction-to-board 13 10.7 1.0 14 10.2 2.00 (1) m/s = meters per second Table 7-2. Thermal Resistance Characteristics (S-PBGA Package) [GNZ] NO. °C/W AIR FLOW (m/s)(1) 1 R Θ JC Junction-to-case 3.3 N/A 2 R Θ JB Junction-to-board 7.46 N/A 3 17.4 0.00 4 14.0 0.5 R Θ JA Junction-to-free air 5 12.3 1.0 6 10.8 2.00 7 0.37 0.00 8 0.47 0.5 PsiJT Junction-to-package top 9 0.57 1.0 10 0.7 2.00 11 11.4 0.00 12 11 0.5 PsiJB Junction-to-board 13 10.7 1.0 14 10.2 2.00 (1) m/s = meters per second Mechanical Data 153 |
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