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LMV242MDA Datasheet(PDF) 4 Page - National Semiconductor (TI) |
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LMV242MDA Datasheet(HTML) 4 Page - National Semiconductor (TI) |
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4 / 16 page ![]() 5.0V Electrical Characteristics Unless otherwise specified, all limits are guaranteed to T J = 25˚C. VDD = 5.0V. Boldface limits apply at temperature extremes (Note 4). (Continued) Symbol Parameter Condition Min Typ Max Units Error Amplifier GBW Gain-Bandwidth Product (Note 8) 5.7 MHz V O Output Swing from Rail From Positive Rail, Sourcing, I O =7mA 31 80 105 mV From Negative Rail Sinking, I O =−7mA 35 80 105 I O Output Short Circuit Current (Note 3) Sourcing, V O = 4.8V 15 31.5 mA Sinking, V O = 0.2V 15 31.5 e n Output Referred Noise f MEASURE = 10 kHz, RF Input = 1800 MHz, -10dBm, 20 k Ω // 68 pF between V COMP1 and VCOMP2, V OUT = 1.4V, set by VRAMP, (Note 8) 770 nV/ SR Slew Rate 2.5 4.9 V/µs Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. Note 2: Human body model: 1.5 k Ω in series with 100 pF. Note 3: The output is not short circuit protected internally. External protection is necessary to prevent overheating and destruction or adverse reliability. Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ =TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Note 5: Power in dBV = dBm + 13 when the impedance is 50 Ω. Note 6: The maximum power dissipation is a function of TJ(MAX) , θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) -TA)/θJA. All numbers apply for packages soldered directly into a PC board. Note 7: All limits are guaranteed by design or statistical analysis. Note 8: Typical values represent the most likely parametric norm. Note 9: Slope and intercept are calculated from graphs "VOUT vs. RF input power" where the current is obtained by division of the voltage by 20 kΩ. Connection Diagrams LLP-10 Bond Pad Layout 20079502 Top View 20079503 Top View www.national.com 4 |
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