THS3201D datasheet(21/29 Pages) TI

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THS3201

SLOS416A − JUNE 2003 − REVISED JANUARY 2004

www.ti.com

For systems where heat dissipation is more critical, the

THS3201 is offered in an 8-pin MSOP with PowerPAD and

the THS3201 is available in the SOIC−8 PowerPAD

package offering even better thermal performance. The

thermal coefficient for the PowerPAD packages are

substantially

improved

over

the

traditional

SOIC.

Maximum power dissipation levels are depicted in the

graph for the available packages. The data for the

PowerPAD packages assume a board layout that follows

the PowerPAD layout guidelines referenced above and

detailed in the PowerPAD application note number

SLMA002. The following graph also illustrates the effect of

not soldering the PowerPAD to a PCB. The thermal

impedance increases substantially which may cause

serious heat and performance issues. Be sure to always

solder

the

PowerPAD

the

PCB

for

optimum

performance.

θJA = 58.4°C/W for 8-Pin MSOP w/PowerPad (DGN)

θJA = 98°C/W for 8-Pin SOIC High Test PCB (D)

θJA = 158°C/W for 8-Pin MSOP w/PowerPad w/o Solder

Results are With No Air Flow and PCB Size = 3”x3”

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

−40

−20

100

TA − Free-Air Temperature − °C

θJA = 98°C/W

θJA = 158°C/W

TJ = 125°C

θJA = 58.4°C/W

Figure 63. Maximum Power Dissipation vs

Ambient Temperature

When determining whether or not the device satisfies the

maximum power dissipation requirement, it is important to

not only consider quiescent power dissipation, but also

dynamic power dissipation. Often times, this is difficult to

quantify because the signal pattern is inconsistent, but an

estimate of the RMS power dissipation can provide

visibility into a possible problem.

DESIGN TOOLS

Evaluation Fixture, Spice Models, and

Applications Support

Texas Instruments is committed to providing its customers

with the highest quality of applications support. To support

this goal an evaluation board has been developed for the

THS3201 operational amplifier. The board is easy to use,

allowing for straightforward evaluation of the device. The

evaluation board can be ordered through the Texas

Instruments web site, www.ti.com, or through your local

Texas Instruments sales representative. The schematic

diagram, board layers, and bill of materials of the

evaluation boards are provided below.

Vin+

J8*

Vs+

C8*

C7*

J9*

Vout

Vs −

Vin−

TP1

VS−

VS+

FB2

FB1

VS−

GND

VS+

*Does Not Apply to the THS3201

768

Ω

768

Ω

49.9

Ω

PD Ref

49.9

Ω

Not Populated

0.1

µF

100 pF

0.1

µF

Figure 64. THS3201 EVM Circuit Configuration

THS3201D Datasheet(PDF) 21 Page - Texas Instruments

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