THS3201D datasheet(23/29 Pages) TI

23 / 29 page

THS3201

SLOS416A − JUNE 2003 − REVISED JANUARY 2004

www.ti.com

Table 2. Bill of Materials

THS3201DGN EVM

Item

Description

SMD

Size

Ref Des

PCB

Quantity

Manufacturer’s Part Number

Bead, ferrite, 3 A, 80

Ω

1206

FB1, FB2

(Steward) HI1206N800R−00

Cap, 22

µF, tanatalum, 25V, 10%

C1, C2

(AVX) TAJD226K025R

Cap, 100 pF, ceramic, 5%, 150V

AQ12

C4, C5

(AVX) AQ12EM101JAJME

Cap, 0.1

µF, ceramic, X7R, 50V

0805

C3, C6

(AVX) 08055C104KAT2A

Open

0805

Resistor, 49.9

Ω, 1/8W, 1%

0805

(Phycomp) 9C08052A49R9FKHFT

Resistor, 768

Ω, 1/8W, 1%

0805

R3, R5

(Phycomp) 9C08052A7680FKHFT

Open

1206

C7, C8

Resistor, 0

Ω, 1/4W, 1%

1206

(KOA) RK73Z2BLTD

Resistor, 49.9

Ω, 1/4W, 1%

1206

(Phycomp) 9C12063A49R9FKRFT

Test point, black

TP1

(Keystone) 5001

Open

J8, J9

Jack, Banana Recptance, 0.25” dia. hole

J5, J6, J7

(HH Smith) 101

Connector, edge, SMA PCB jack

J1, J2, J4

(Johnson) 142−0701−801

Standoff, 4−40 hex, 0.625” length

(Keystone) 1804

Screw, Phillips, 4−40, .250”

SHR−0440−016−SN

IC, THS3201

(TI) THS3201DGN

Board, printed circuit

(TI) Edge # 6447972 Rev.A

NOTE: The components shown in the BOM were used in test by TI.

Computer simulation of circuit performance using SPICE

is often useful when analyzing the performance of analog

circuits and systems. This is particularly true for video and

RF-amplifier circuits where parasitic capacitance and

inductance can have a major effect on circuit performance.

A SPICE model for the THS3201 is available through

either the Texas Instruments web site (www.ti.com) or as

one model on a disk from the Texas Instruments Product

Information Center (1–800–548–6132). The PIC is also

available for design assistance and detailed product

information at this number. These models do a good job of

predicting small-signal ac and transient performance

under a wide variety of operating conditions. They are not

intended to model the distortion characteristics of the

amplifier, nor do they attempt to distinguish between the

package types in their small-signal ac performance.

Detailed information about what is and is not modeled is

contained in the model file itself.

ADDITIONAL REFERENCE MATERIAL

PowerPAD Made Easy, application brief (SLMA004)

PowerPAD Thermally Enhanced Package, technical brief

(SLMA002)

Voltage Feedback vs. Current Feedback amplifiers,

(SLVA051)

Current

Feedback

Analysis

and

Compensation

(SLOA021)

Current Feedback Amplifiers: Review, Stability, and

Application (SBOA081)

Effect of parasitic capacitance in op amp circuits

(SLOA013)

THS3201D Datasheet(PDF) 23 Page - Texas Instruments

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