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STM32H742AI Datasheet(PDF) 345 Page - STMicroelectronics |
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STM32H742AI Datasheet(HTML) 345 Page - STMicroelectronics |
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345 / 357 page ![]() DS12110 Rev 7 345/357 STM32H742xI/G STM32H743xI/G Package information 352 Figure 138. UFBGA176+25 package recommended footprint eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 225. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 224. UFBGA176+25 package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A0E7_FP_V1 Dpad Dsm |
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