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CAT3606HS4 Datasheet(PDF) 9 Page - Catalyst Semiconductor |
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CAT3606HS4 Datasheet(HTML) 9 Page - Catalyst Semiconductor |
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9 / 11 page ![]() CAT3606 9 Doc. No. 5009, Rev. B © 2005 by Catalyst Semiconductor, Inc. Characteristics subject to change without notice RECOMMENDED LAYOUT When the driver is in the 1.5x charge pump mode, the 1MHz switching frequency operation requires to minimize trace length and impedance to ground on all 4 capacitors. A ground plane should cover the area on the bottom side of the PCB opposite to the IC and the bypass capacitors. Capacitors Cin and Cout require short connection to ground which can be done with multiple vias as shown on Figure 2. A square copper area matches the QFN16 exposed pad (GND) and must be connected to the ground plane underneath. The use of multiple via will improve the heat dissipation. Figure 2: PCB Layout TYPICAL CHARACTERISTICS VIN = 3.6V, EN = VIN, ENM = ENS = GND, C IN = COUT = 1µF, TAMB = 25˚C, unless otherwise specified. RSET Pin Voltage vs. Temperature 0 1 2 3 4 5 0 100 200 300 400 500 1x mode 1.16 1.18 1.20 1.22 1.24 -50 -25 0 25 50 75 100 125 TEMPERATURE [ °C] OUTPUT CURRENT [mA] Foldback Current Limiting PWM Dimming at 1kHz on ENM and ENS |
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