PDTC124XMB

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 1 — 26 June 2012

7 of 11

NXP Semiconductors

PDTC124XMB

NPN resistor-equipped transistor; R1 = 22 k

Ω, R2 = 47 kΩ

9.

Package outline

10. Soldering

Fig 10. DFN1006B-3 (SOT883B)

11-11-02

Dimensions in mm

2

3

0.55

0.47

0.30

0.22

1

0.40

0.34

0.30

0.22

0.20

0.12

0.65

0.04 max

0.35

0.65

0.55

1.05

0.95

Fig 11. Reflow soldering footprint for SOT883B (DFN1006B-3)

1.3

0.3

0.6

0.7

0.4

0.9

0.3

(2x)

0.4

(2x)

0.25

(2x)

R0.05 (8x)

0.7

Footprint information for reflow soldering

SOT883B

sot883b_fr

occupied area

solder land

solder resist

solder land plus solder paste

solder paste deposit

Dimensions in mm