108

080216

Glass Encapsulated SMD Varistor MLV

(VJ13, 14, 15, 20)

Surface Mounting Guide

SURFACE MOUNTING GUIDE (VJ13, 14, 15, 20, 32)

APPLICATIONS NOTES

SOLDERABILITY/LEACHING

Terminations to be well soldered after immersion in a 60/40

tin/lead solder bath at 235±5ºC for 2±1 seconds.

Terminations will resist leaching for at least the immersion

times and conditions recommendations shown below.

a) The visual standards used for evaluation of solder joints

will need to be modified as lead free joints are not as

bright as with tin-lead pastes and the fillet may not be as

large.

b) Lead-free solder pastes do not allow the same self align-

ment as lead containing systems. Standard mounting

pads are acceptable, but machine set up may need to

be modified.

P/N

Termination Type

Solder

Solder

Immersion

Tin/Lead

Temp. ºC

Time (sec)

Plated MLV

VJ

Nickel and Matte Tin

60/40

260±5

30±1

Plating Termination

Unplated MLV

Plated MLV

Electrodes

Thick

Film

Material

Electrodes

Solder Layer

Nickel Layer

Thick

Film

Material

D1

D2

D3

D4

D5

Case

D1

D2

D3

D4

D5

Size

1206

4.00 (0.157)

1.00 (0.039)

2.00 (0.079) 1.00 (0.039)

1.06 (0.042)

1210

4.00 (0.157)

1.00 (0.039)

2.00 (0.079) 1.00 (0.039)

2.05 (0.081)

1812

5.60 (0.220)

1.00 (0.039)

3.60 (0.142) 1.00 (0.039)

3.00 (0.118)

2220

6.60 (0.260)

1.00 (0.039)

4.60 (0.181) 1.00 (0.039)

5.00 (0.197)

3220

10.21 (0.402) 2.21 (0.087)

5.79 (0.228) 2.21 (0.087)

5.50 (0.217)

REFLOW SOLDERING

Dimensions in mm (inches)

Case

D1

D2

D3

D4

D5

Size

1206

5.00 (0.197)

1.50 (0.059)

2.00 (0.079) 1.50 (0.059)

1.06 (0.042)

1210

5.00 ( 0.197) 1.50 (0.059)

2.00 (0.079) 1.50 (0.059)

2.05 (0.081)

1812

6.60 (0.260)

1.50 (0.059)

3.60 (0.142) 1.50 (0.059)

3.00 (0.118)

2220

7.60 (0.299)

1.50 (0.059)

4.60 (0.181) 1.50 (0.059)

5.00 (0.197)

3220

11.21 (0.441) 1.50 (0.059)

5.79 (0.228) 1.50 (0.059)

5.50 (0.217)

WAVE SOLDERING

Dimensions in mm (inches)

RECOMMENDED

SOLDER PAD

LAYOUT

300

250

200

150

100

50

0

0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

MAXIMUM TEMPERATURE 260ºC

20 - 40 SECONDS WITH 5ºC

RAMP RATE

< 3ºC/s

PREHEAT ZONE

60 - 150 SEC

> 217ºC

VJ Products Lead-Free Reflow Profile

RECOMMENDED SOLDERING PROFILES

VJ products are compatible with a wide range of soldering

conditions consistent with good manufacturing practice for

surface mount components. This includes Pb free reflow

processes and peak temperatures up to 270ºC.

Recommended profiles for reflow and wave soldering are

show below for reference.

VC products are recommended for lead soldering applica-

tion or gluing techniques.