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MPC852T Datasheet(PDF) 77 Page - Freescale Semiconductor, Inc |
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MPC852T Datasheet(HTML) 77 Page - Freescale Semiconductor, Inc |
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77 / 80 page  MPC852T Hardware Specifications, Rev. 3.1 Freescale Semiconductor 77 Mechanical Data and Ordering Information Figure 64. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package Note: Solder sphere composition is 95.5%Sn 45%Ag 0.5%Cu for MPC852TVRXXX. Solder sphere composition is 62%Sn 36%Pb 2%Ag for MPC852TZTXXX. 1. All dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M —1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is defined by the spherical crowns of the solder balls. NOTES: |
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