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IRFS3607PBF Datasheet(PDF) 7 Page - Thinki Semiconductor Co., Ltd.

Part # IRFS3607PBF
Description  ThinkiSemi 85V,92A N-Channel Trench Process Power MOSFETs
PDF  7 Pages
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Manufacturer  THINKISEMI [Thinki Semiconductor Co., Ltd.]
Direct Link  http://www.thinkisemi.com
Logo THINKISEMI - Thinki Semiconductor Co., Ltd.

IRFS3607PBF Datasheet(HTML) 7 Page - Thinki Semiconductor Co., Ltd.

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IRFB3607PbF/IRFS3607PbF/IRFSL3607PbF
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Dimension D and E do not include mold flash. Mold flash shall
not exceed 0.127 mm (0.005") per side. These dimensions are
measured at the outmost extremes of the plastic body
(3) Thermal pad contour optional within dimension E, L1, D1 and E1
(4) Dimension b1 and c1 apply to base metal only
(5) Controlling dimension: inches
(6) Outline conform to JEDEC TO-262 except A1 (maximum), b
(minimum) and D1 (minimum) where dimensions derived the
actual package outline
SYMBOL
MILLIMETERS
INCHES
NOTES
MIN.
MAX.
MIN.
MAX.
A
4.06
4.83
0.160
0.190
A1
2.03
3.02
0.080
0.119
b
0.51
0.99
0.020
0.039
b1
0.51
0.89
0.020
0.035
4
b2
1.14
1.78
0.045
0.070
b3
1.14
1.73
0.045
0.068
4
c
0.38
0.74
0.015
0.029
c1
0.38
0.58
0.015
0.023
4
c2
1.14
1.65
0.045
0.065
D
8.51
9.65
0.335
0.380
2
D1
6.86
8.00
0.270
0.315
3
E
9.65
10.67
0.380
0.420
2, 3
E1
7.90
8.80
0.311
0.346
3
e
2.54 BSC
0.100 BSC
L
13.46
14.10
0.530
0.555
L1
-
1.65
-
0.065
3
L2
3.56
3.71
0.140
0.146
(4)
(4)
Base
metal
Plating
b1, b3
(b, b2)
c1
c
Section B - B and C - C
Scale: None
Section A - A
(3)
E1
(3)
D1
E
B
A
A
A
c2
c
A1
Seating
plane
Lead tip
(3)
(2) (3)
(2)
A
E
(Datum A)
L1
L2
B
B
C
C
3
2
1
L
D
2 x e
3 x b2
3 x b
0.010
A
B
MM
Modified JEDEC outline TO-262
Lead assignments
Diodes
1. - Anode (two die)/open (one die)
2., 4. - Cathode
3. - Anode
TO-262/I2PAK
PACKAGE OUTLINE
© 1995 Thinki Semiconductor Co., Ltd.
http://www.thinkisemi.com.tw/
Page 7/7
Rev.10T



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