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MMZ09312B Datasheet(PDF) 1 Page - NXP Semiconductors

Part # MMZ09312B
Description  Heterojunction Bipolar Transistor Technology (InGaP HBT)
PDF  28 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MMZ09312B Datasheet(HTML) 1 Page - NXP Semiconductors

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MMZ09312BT1
1
RF Device Data
Freescale Semiconductor, Inc.
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
High Efficiency/Linearity Amplifier
The MMZ09312B is a 2-- stage high efficiency, Class AB InGaP HBT
amplifier designed for use as a linear driver amplifier in wireless base station
applications as well as an output stage in femtocell or repeater applications. It
is suitable for applications with frequencies from 400 to 1000 MHz such as
CDMA, GSM, LTE and ZigBeeR at operating voltages from 3 to 5 Volts.
 Typical Performance: VCC1 =VCC2 =VBIAS =5 Vdc, ICQ =74 mA
Frequency
Pout
(dBm)
Gps
(dB)
ACPR
(dBc)
PAE
(%)
Test Signal
900 MHz
24
31.5
--50.0
26.0
IS--95 CDMA
900 MHz
18.0
31.5
--50.0
10.8
1C W--CDMA TM1
900 MHz
17.0
31.5
--50.0
9.0
10 MHz LTE TM1.1
750 MHz
17.5
32.0
--50.0
15.3
LTE 10/20 MHz
450 MHz
29
33.0
--40.0
57.0
ZigBee
Features
 Frequency: 400--1000 MHz
 P1dB: 29.6 dBm @ 900 MHz
 Power Gain: 31.7 dB @ 900 MHz
 OIP3: 42 dBm @ 900 MHz
 Active Bias Control (adjustable externally)
 Single 3 to 5 V Supply
 Performs Well with Digital Predistortion Systems
 Single--ended Power Detector
 Cost--effective 12--pin, 3 mm QFN Surface Mount Package
 In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7--inch Reel.
Table 1. Typical Performance (1)
Characteristic
Symbol
450
MHz
900
MHz
Unit
Small--Signal Gain (S21)
Gp
33.8
31.7
dB
Input Return Loss (S11)
IRL
--22
--15
dB
Output Return Loss (S22)
ORL
--25
--18
dB
Power Output @ 1dB
Compression
P1dB
28.8
29.6
dBm
1. VCC1 =VCC2 =VBIAS =5 Vdc, TA =25C, 50 ohm system, CW
Application Circuit
Table 2. Maximum Ratings
Rating
Symbol
Value
Unit
Supply Voltage
VCC
6
V
Supply Current
ICC
550
mA
RF Input Power
Pin
14
dBm
Storage Temperature Range
Tstg
--65 to +150
C
Junction Temperature
TJ
175
C
Table 3. Thermal Characteristics
Characteristic
Symbol
Value (2)
Unit
Thermal Resistance, Junction to Case
Case Temperature 84C, VCC1 =VCC2 =VBIAS =5 Vdc
RJC
56
C/W
2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
Freescale Semiconductor
Technical Data
Document Number: MMZ09312B
Rev. 2, 12/2014
400--1000 MHz, 31.7 dB
29.6 dBm
InGaP HBT LINEAR AMPLIFIER
MMZ09312BT1
QFN 3  3
 Freescale Semiconductor, Inc., 2011--2012, 2014. All rights reserved.


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