HCPL-5150 datasheet(4/16 Pages) HP

4 / 16 page

Absolute Maximum Ratings

Notes:

1. No derating required with the typical case-to-ambient thermal resistance. (

CA=140°C/W) Refer to Figure 35.

2. Maximum pulse width = 10

µs, maximum duty cycle = 0.2%. This value is intended to allow for component tolerances for designs with I

O peak minimum

= 0.5 A. See Applications section for additional details on limiting IOH peak.

3. Derate linearly above 102

°C free air temperature at a rate of 6mW/°C with the typical case-to-ambient thermal resistance (θ

CA=140°C/W).

Refer to Figure 36.

4. Derate linearly above 102

°C free air temperature at a rate of 6mW/°C with the typical case-to-ambient thermal resistance (θ

CA=140°C/W).

Refer to Figure 35 and 36.

ESD Classification

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

-65

+150

°C

Operating Temperature

-55

+125

°C

Case Temperature

+145

°C

Junction Temperature

+150

°C

Lead Solder Temperature

260 for 10s

°C

Average Input Current

IF AVG

Peak Transient Input Current

(<1

µs pulse width, 300 pps)

IF PK

1.0

Reverse Input Voltage

“High” Peak Output Current

IOH (PEAK)

0.6

“Low” Peak Output Current

IOL (PEAK)

0.6

Supply Voltage

(VCC-VEE)0

Output Voltage

VO (PEAK)

0VCC

Input Power Dissipation

Output Power Dissipation

250

Total Power Dissipation

295

MIL-STD-883, Method 3015

(▲), Class 1

Parameter

Symbol

Min.

Max.

Units

Power Supply Voltage

(VCC – VEE)

1530Volts

Input Current (ON)

IF (ON)

Input Voltage (OFF)

VF (OFF)

-3.0

0.8

Volts

Operating Temperature

-55

125

°C

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