TPS22976DPUT datasheet(4/32 Pages) TI

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TPS22976

SLVSDE7B – NOVEMBER 2016 – REVISED SEPTEMBER 2017

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT(2)

VIN1,2

Input voltage

–0.3

VOUT1,2

Output voltage

–0.3

VON1,2

ON-pin voltage

–0.3

VBIAS

Bias voltage

–0.3

IMAX

Maximum continuous switch current per channel

IPLS

Maximum pulsed switch current per channel, pulse < 300 µs, 3% duty cycle

Maximum junction temperature

125

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

(1)

See the Input Capacitor (Optional) section.

(2)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the

maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package

in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max))

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

VIN1,2

Input voltage

0.6

VBIAS

Bias voltage

2.5

5.7

VON1,2

ON voltage

5.7

VOUT1,2

Output voltage

VIN

VIH

High-level input voltage, ON

VBIAS = 2.5 V to 5 V, TA< 85°C

1.05

5.7

VBIAS = 2.5 V to 5.7 V, TA< 105°C

1.2

5.7

VIL

Low-level input voltage, ON

VBIAS = 2.5 V to 5.7 V

0.5

CIN1,2

Input capacitor

1(1)

µF

Operating free-air temperature (2)

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TPS22976

UNIT

DPU (WSON)

14 PINS

RθJA

Junction-to-ambient thermal resistance

50.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52.3

°C/W

RθJB

Junction-to-board thermal resistance

18.4

°C/W

ψJT

Junction-to-top characterization parameter

1.6

°C/W

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