TPS22976DPUT datasheet(17/32 Pages) TI

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TPS22976

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SLVSDE7B – NOVEMBER 2016 – REVISED SEPTEMBER 2017

Product Folder Links: TPS22976

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Feature Description (continued)

9.3.2 Input Capacitor (Optional)

To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a

discharged load capacitor, a capacitor needs to be placed between VIN and GND. A 1-µF ceramic capacitor, CIN,

placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop

during high-current application. When switching heavy loads, it is recommended to have an input capacitor about

10 times higher than the output capacitor to avoid excessive voltage drop.

9.3.3 Output Capacitor (Optional)

Due to the integrated body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL

greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current

flow through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN

dip caused by inrush currents during startup, however a 10 to 1 ratio for capacitance is not required for proper

functionality of the device. A ratio smaller than 10 to 1 (such as 1 to 1) could cause slightly more VIN dip upon

turnon due to inrush currents. This can be mitigated by increasing the capacitance on the CT pin for a longer rise

time. (See the Adjustable Rise Time section).

9.3.4 Quick Output Discharge (QOD) (Not Present in TPS22976N)

The TPS22976 includes a QOD feature. When the switch is disabled, an internal discharge resistance is

connected between VOUT and GND to remove the remaining charge from the output. This resistance prevents

the output from floating while the switch is disabled. For best results, it is recommended that the device gets

disabled before VBIAS falls below the minimum recommended voltage.

9.3.5 Thermal Shutdown

Thermal Shutdown protects the part from internally or externally generated excessive temperatures. When the

device temperature exceeds TSD (typical 160°C), the switch is turned off. The switch automatically turns on again

if the temperature of the die drops 20 degrees below the TSD threshold.

9.4 Device Functional Modes

Table 1 lists the TPS22976 functions.

Table 1. TPS22976 Functions Table

VIN to VOUT

VOUT

Off

GND

VIN

Table 2 lists the TPS22976N functions.

Table 2. TPS22976N Functions Table

VIN to VOUT

VOUT

Off

Floating

VIN

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