ZMOD4510 Datasheet

© 2020 Renesas Electronics Corporation

10

February 7, 2020

9. Assembly Restrictions, Operation, Integration Notes, and Storage

When implementing the ZMOD4510 in electrical circuit boards, a gas sensor module may react to chemicals during the assembly process and

to outgassing components, such as resins from the printed circuit board (PCB) assembly. A standard soldering profile can be used to assemble

the ZMOD4510 on the user’s PCB and should fulfill the IPC/JEDEC J-STD-020C Standard (“Moisture/Reflow Sensitivity Classification for Non-

hermetic Solid State Surface Mount Devices”). A typical lead-free reflow solder profile is shown in Figure 3. After assembly, an outgassing of

the PCB and electronic components must be considered, especially when operating the sensor module at elevated temperatures. This will

ultimately influence the sensor signal and accuracy of the Air Quality Index (AQI). A PCB heat treatment before assembling the ZMOD4510 is

recommended. After the gas sensor module assembly, no coating, cleaning, or ultrasonic bath should be applied to the PCB.

Store the sensor in an antistatic metallic bag with a low VOC background after the sensor module is removed from its original packaging or the

assembled PCB is populated. The optimal storage conditions are <1 ppm TVOC, <100 ppb O3, <100 ppb NO2, 10°C to 50°C, and humidity

levels within 20% to 80%RH. If the sensor is stored outside of these conditions for extended periods of time, the sensor readings can exhibit a

temporary offset. The sensor can be reconditioned and brought back to its calibration state by operation for 24 hours to 48 hours in clean air.

To operate the ZMOD4510, the software and libraries provided by Renesas can be used. For implementing the sensor module in a customer-

specific application, detailed information on the programming is available. The ZMOD4510 Programming Manual - Read Me explains

documentation, libraries for supported controllers and compilers, code examples in C, and the minimum requirements for the host MCU for an

easy integration (see section 12).

Figure 3. Typical Solder Profile