SN74LVC2G08 datasheet(5/20 Pages) TI

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6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage

Operating

1.65

5.5

Data retention only

1.5

VIH

High-level input voltage

VCC = 1.65 V to 1.95 V

0.65 × VCC

VCC = 2.3 V to 2.7 V

1.7

VCC = 3 V to 3.6 V

VCC = 4.5 V to 5.5 V

0.7 × VCC

VIL

Low-level input voltage

VCC = 1.65 V to 1.95 V

0.35 × VCC

VCC = 2.3 V to 2.7 V

0.7

VCC = 3 V to 3.6 V

0.8

VCC = 4.5 V to 5.5 V

0.3 × VCC

Input voltage

5.5

Output voltage

VCC

IOH

High-level output current

VCC = 1.65 V

–4

VCC = 2.3 V

–8

VCC = 3 V

–16

–24

VCC = 4.5 V

–32

IOL

Low-level output current

VCC = 1.65 V

VCC = 2.3 V

VCC = 3 V

VCC = 4.5 V

Δt/Δv Input transition rise or fall rate

VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V

ns/V

VCC = 3.3 V ± 0.3 V

VCC = 5 V ± 0.5 V

Operating free-air temperature

SN74LVC2G08DCU-Q1

–40

125

°C

SN74LVC2G08DCT-Q1

–40

6.4 Thermal Information

THERMAL METRIC(1)

SN74LVC2G08-Q1

UNIT

DCT (SM8)

DCU (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

220

201.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

117.2

91.9

°C/W

RθJB

Junction-to-board thermal resistance

100

122.6

°C/W

ΨJT

Junction-to-top characterization parameter

42.4

31.8

°C/W

ΨJB

Junction-to-board characterization parameter

98.9

122.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

SN74LVC2G08-Q1

SCES557E – MARCH 2004 – REVISED OCTOBER 2020

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