F280041PMSR datasheet(64/231 Pages) TI

64 / 231 page

TMS320F280049, TMS320F280049C

TMS320F280048, TMS320F280048C, TMS320F280045

TMS320F280041, TMS320F280041C, TMS320F280040, TMS320F280040C

SPRS945E – JANUARY 2017 – REVISED APRIL 2020

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Product Folder Links: TMS320F280049 TMS320F280049C TMS320F280048 TMS320F280048C TMS320F280045

TMS320F280041 TMS320F280041C TMS320F280040 TMS320F280040C

Specifications

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2)

lfm = linear feet per minute

5.7.3

RSH Package

°C/W(1)

AIR FLOW (lfm)(2)

RΘJC

Junction-to-case thermal resistance

11.9

N/A

RΘJB

Junction-to-board thermal resistance

3.3

N/A

RΘJA (High k PCB)

Junction-to-free air thermal resistance

25.8

RΘJMA

Junction-to-moving air thermal resistance

17.4

150

15.1

250

13.4

500

PsiJT

Junction-to-package top

0.2

0.3

150

0.4

250

0.4

500

PsiJB

Junction-to-board

3.3

3.2

150

3.2

250

3.2

500

RΘJC, bottom

Junction-to-bottom case thermal resistance

0.7

5.8

Thermal Design Considerations

Based on the end application design and operational profile, the IDD and IDDIO currents could vary.

Systems that exceed the recommended maximum power dissipation in the end product may require

additional thermal enhancements. Ambient temperature (TA) varies with the end application and product

design. The critical factor that affects reliability and functionality is TJ, the junction temperature, not the

ambient temperature. Hence, care should be taken to keep TJ within the specified limits. Tcase should be

measured to estimate the operating junction temperature TJ. Tcase is normally measured at the center of

the package top-side surface. The thermal application report Semiconductor and IC Package Thermal

Metrics helps to understand the thermal metrics and definitions.

F280041PMSR Datasheet(PDF) 64 Page - Texas Instruments

F280041PMSR Datasheet(HTML) 64 Page - Texas Instruments

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