CDC950

133MHz DIFFERENTIAL CLOCK SYNTHESIZER/DRIVER FOR

PC MOTHERBOARDS/SERVERS

SCAS646B − FEBRUARY 2001 − REVISED OCTOBER 2003

5

POST OFFICE BOX 655303

Function Tables (Continued)

Table 5. Host/HOST Output Buffer Specifications

INPUT

BOARD TARGET

REFERENCE R,

OUTPUT CURRENT

VOH at Z

MultSel0

MultSel1

BOARD TARGET

TRACE/TERM Z

REFERENCE R,

IREF = VDD/(3 Rr)

OUTPUT CURRENT

IOH

VOH at Z

0

0

60

Ω

Rr = 475 1%,

I_REF = 2.32 mA

5

× IREF

0.71 V at 60

Ω

0

0

50

Ω

Rr = 475 1%,

I_REF = 2.32 mA

5

× IREF

0.59 V at 50

Ω

0

1

60

Ω

Rr = 475 1%,

I_REF = 2.32 mA

6

× IREF

0.85 V at 60

Ω

0

1

50

Ω

Rr = 475 1%,

I_REF = 2.32 mA

6

× IREF

0.71 V at 50

Ω

1

0

60

Ω

Rr = 475 1%,

I_REF = 2.32 mA

4

× IREF

0.56 V at 60

Ω

1

0

50

Ω

Rr = 475 1%,

I_REF = 2.32 mA

4

× IREF

0.47 V at 50

Ω

1

1

60

Ω

Rr = 475 1%,

I_REF = 2.32 mA

7

× IREF

0.99 V at 60

Ω

1

1

50

Ω

Rr = 475 1%,

I_REF = 2.32 mA

7

× IREF

0.82 V at 50

Ω

0

0

30 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

5

× IREF

0.75 V at 30

Ω

0

0

25 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

5

× IREF

0.62 V at 25

Ω

0

1

30 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

6

× IREF

0.90 V at 30

Ω

0

1

25 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

6

× IREF

0.75 V at 25

Ω

1

0

30 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

4

× IREF

0.60 V at 30

Ω

1

0

25 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

4

× IREF

0.5 V at 25

Ω

1

1

30 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

7

× IREF

1.05 V at 30

Ω

1

1

25 (dc equivalent)

Rr = 221 1%,

I_REF = 5 mA

7

× IREF

0.84 V at 25

Ω

NOTE: The entries in boldface are the primary system configurations of interest. The outputs should be optimized for these configurations.

−0.5 V to 4.3 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 1)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

89

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1070 mW

. . . . . . . . . . . . . . . . . . . . . . . . . . .

–0

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for the through-hole packages,

which use a trace length of zero.

3. The maximum package power dissipation is calculated using a junction temperature of 150

°C and a board trace length of 750 mils.

For more information, refer to the Package Thermal Considerations application note in the ABT Advanced BiCMOS Technology Data

Book, literature number SCBD002.