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TLV9002IDDFR Datasheet(PDF) 52 Page - Texas Instruments |
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TLV9002IDDFR Datasheet(HTML) 52 Page - Texas Instruments |
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52 / 86 page  www.ti.com PACKAGE OUTLINE C TYP 5.05 4.75 1.1 MAX 8X 0.5 10X 0.27 0.17 2X 2 0.15 0.05 TYP 0.23 0.13 0 - 8 0.25 GAGE PLANE 0.7 0.4 A NOTE 3 3.1 2.9 B NOTE 4 3.1 2.9 4221984/A 05/2015 VSSOP - 1.1 mm max height DGS0010A SMALL OUTLINE PACKAGE NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187, variation BA. 1 10 0.1 C A B 6 5 PIN 1 ID AREA SEATING PLANE 0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 3.200 |
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