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LTC7802EUFDM Datasheet(PDF) 27 Page - Analog Devices

Part # LTC7802EUFDM
Description  40V Low IQ, 3MHz Dual, 2-Phase Synchronous Step-Down Controller with Spread Spectrum
PDF  34 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC7802EUFDM Datasheet(HTML) 27 Page - Analog Devices

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LTC7802
27
Rev. 0
For more information www.analog.com
filter time constant should be RC = ESL/RSENSE =
0.2nH/2mΩ = 100ns, which may be implemented with
100Ω resistor in series with the SENSE+ pin and 1nF
capacitor between SENSE+ and SENSE–.
5. Select the feedback resistors. If very light load effi-
ciency is required, high value feedback resistors may
be used to minimize the current due to the feedback
divider. However, in most applications a feedback
divider current in the range of 10μA to 100μA or more
is acceptable. For a 50μA feedback divider current,
RA = 0.8V/50μA = 16kΩ. RB can then be calculated as
RB = RA(3.3V/0.8V – 1) = 50kΩ.
6. Select the MOSFETs. The best way to evaluate MOSFET
performance in a particular application is to build and
test the circuit on the bench, facilitated by an LTC7802
demo board. However, an educated guess about the
application is helpful to initially select MOSFETs. Since
this is a high current, low voltage application, I2R
losses will likely dominate over transition losses for the
top MOSFET. Therefore, choose a MOSFET with lower
RDS(ON) as opposed to lower gate charge to minimize
the combined loss terms. The bottom MOSFET does
not experience transition losses, and its power loss is
generally dominated by I2R losses. For this reason,
the bottom MOSFET is typically chosen to be of lower
RDS(ON) and subsequently higher gate charge than the
top MOSFET.
Due to the high current in this application, two MOSFETs
may needed in parallel to more evenly balance the dis-
sipated power and to lower the RDS(ON). Be sure to
select logic-level threshold MOSFETs, since the gate
drive voltage is limited to 5.1V (INTVCC). Minimize the
inductance of the TG and BG gate drive traces and their
respective return paths to the controller IC (SW and
GND) by using wide traces and multiple parallel vias.
7. Select the input and output capacitors. CIN is chosen
for an RMS current rating of at least 10A (IOUT/2, with
margin) at temperature assuming only this channel
is on. COUT is chosen with an ESR of 3mΩ for low
output ripple. Multiple capacitors connected in parallel
may be required to reduce the ESR to this level. The
output ripple in continuous mode will be highest at the
maximum input voltage. The output voltage ripple due
to ESR is approximately:
VORIPPLE = ESR • ΔIL = 3mΩ • 6A = 18mVP-P
On the 3.3V output, this is equal to 0.55% of peak to
peak voltage ripple.
8. Determine the bias supply components. Since the reg-
ulated output is not greater than the EXTVCC switcho-
ver threshold (4.7V), it cannot be used to bias INTVCC.
However, if another supply is available, for example
if the other channel is regulating to 5V, connect that
supply to EXTVCC to improve the efficiency.
For a 6.5ms soft-start, select a 0.1μF capacitor for the
TRACK/SS pin. As a first pass estimate for the bias
components, select CINTVCC = 4.7μF, boost supply
capacitor CB = 0.1μF and low forward drop boost sup-
ply diode CMDSH-4E from Central Semiconductor.
9. Determine and set application-specific parameters.
Set the MODE pin based on the trade-off of light load
efficiency and constant frequency operation. Set the
PLLIN/SPREAD pin based on whether a fixed, spread
spectrum, or phase-locked frequency is desired. The
RUN pin can be used to control the minimum input
voltage for regulator operation or can be tied to VIN
for always-on operation. Use ITH compensation com-
ponents from the typical applications as a first guess,
check the transient response for stability, and modify
as necessary.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. Figure 8 illustrates the current waveforms present
in the various branches of the synchronous regulators
operating in the continuous mode. Check the following
in your layout:
1. Are the top N-channel MOSFETs located within 1cm of
each other with a common drain connection at CIN?
Decoupling capacitors for the two channels they should
be close to each other to avoid a large resonant loop.
APPLICATIONS INFORMATION



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