| Electronic Components Datasheet Search |
|
LTC7802EUFDM Datasheet(PDF) 27 Page - Analog Devices |
|
|
|||||||||||||||||||||||||||||
LTC7802EUFDM Datasheet(HTML) 27 Page - Analog Devices |
|
27 / 34 page ![]() LTC7802 27 Rev. 0 For more information www.analog.com filter time constant should be RC = ESL/RSENSE = 0.2nH/2mΩ = 100ns, which may be implemented with 100Ω resistor in series with the SENSE+ pin and 1nF capacitor between SENSE+ and SENSE–. 5. Select the feedback resistors. If very light load effi- ciency is required, high value feedback resistors may be used to minimize the current due to the feedback divider. However, in most applications a feedback divider current in the range of 10μA to 100μA or more is acceptable. For a 50μA feedback divider current, RA = 0.8V/50μA = 16kΩ. RB can then be calculated as RB = RA(3.3V/0.8V – 1) = 50kΩ. 6. Select the MOSFETs. The best way to evaluate MOSFET performance in a particular application is to build and test the circuit on the bench, facilitated by an LTC7802 demo board. However, an educated guess about the application is helpful to initially select MOSFETs. Since this is a high current, low voltage application, I2R losses will likely dominate over transition losses for the top MOSFET. Therefore, choose a MOSFET with lower RDS(ON) as opposed to lower gate charge to minimize the combined loss terms. The bottom MOSFET does not experience transition losses, and its power loss is generally dominated by I2R losses. For this reason, the bottom MOSFET is typically chosen to be of lower RDS(ON) and subsequently higher gate charge than the top MOSFET. Due to the high current in this application, two MOSFETs may needed in parallel to more evenly balance the dis- sipated power and to lower the RDS(ON). Be sure to select logic-level threshold MOSFETs, since the gate drive voltage is limited to 5.1V (INTVCC). Minimize the inductance of the TG and BG gate drive traces and their respective return paths to the controller IC (SW and GND) by using wide traces and multiple parallel vias. 7. Select the input and output capacitors. CIN is chosen for an RMS current rating of at least 10A (IOUT/2, with margin) at temperature assuming only this channel is on. COUT is chosen with an ESR of 3mΩ for low output ripple. Multiple capacitors connected in parallel may be required to reduce the ESR to this level. The output ripple in continuous mode will be highest at the maximum input voltage. The output voltage ripple due to ESR is approximately: VORIPPLE = ESR • ΔIL = 3mΩ • 6A = 18mVP-P On the 3.3V output, this is equal to 0.55% of peak to peak voltage ripple. 8. Determine the bias supply components. Since the reg- ulated output is not greater than the EXTVCC switcho- ver threshold (4.7V), it cannot be used to bias INTVCC. However, if another supply is available, for example if the other channel is regulating to 5V, connect that supply to EXTVCC to improve the efficiency. For a 6.5ms soft-start, select a 0.1μF capacitor for the TRACK/SS pin. As a first pass estimate for the bias components, select CINTVCC = 4.7μF, boost supply capacitor CB = 0.1μF and low forward drop boost sup- ply diode CMDSH-4E from Central Semiconductor. 9. Determine and set application-specific parameters. Set the MODE pin based on the trade-off of light load efficiency and constant frequency operation. Set the PLLIN/SPREAD pin based on whether a fixed, spread spectrum, or phase-locked frequency is desired. The RUN pin can be used to control the minimum input voltage for regulator operation or can be tied to VIN for always-on operation. Use ITH compensation com- ponents from the typical applications as a first guess, check the transient response for stability, and modify as necessary. PC Board Layout Checklist When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the IC. Figure 8 illustrates the current waveforms present in the various branches of the synchronous regulators operating in the continuous mode. Check the following in your layout: 1. Are the top N-channel MOSFETs located within 1cm of each other with a common drain connection at CIN? Decoupling capacitors for the two channels they should be close to each other to avoid a large resonant loop. APPLICATIONS INFORMATION |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |