TLV9042IDDFR datasheet(8/62 Pages) TI

8 / 62 page

7.4 Thermal Information for Single Channel

THERMAL METRIC (1)

TLV9041, TLV9041S

UNIT

DBV

(SOT-23)

DCK (2)

(SC70)

DQN (2)

(X2SON)

5 PINS

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

235.4

214.6

233.8

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

135.1

134.2

130.7

TBD

°C/W

RθJB

Junction-to-board thermal resistance

103.2

95.6

79.7

TBD

°C/W

ψJT

Junction-to-top characterization parameter

75.6

73.8

51.6

TBD

°C/W

ψJB

Junction-to-board characterization parameter

102.7

95.3

79.1

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is preview for TLV9041.

7.5 Thermal Information for Dual Channel

THERMAL METRIC (1)

TLV9042, TLV9042S

UNIT

(SOIC)

DDF

(SOT-23-8)

DSG

(WSON)

(TSSOP)

RUG

(X2QFN)

8 PINS

10 PINS

RθJA

Junction-to-ambient thermal

resistance

148.3

203.8

99.8

203.1

196.9

°C/W

RθJC(top)

Junction-to-case (top) thermal

resistance

89.8

123.9

122.2

91.9

87.6

°C/W

RθJB

Junction-to-board thermal

resistance

91.6

121.6

66.0

133.8

117.8

°C/W

ψJT

Junction-to-top characterization

parameter

38.6

21.7

13.8

23.7

3.4

°C/W

ψJB

Junction-to-board characterization

parameter

90.9

199.6

65.9

132.1

117.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal

resistance

n/a

41.9

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.6 Thermal Information for Quad Channel

THERMAL METRIC (1)

TLV9044, TLV9044S

UNIT

(SOIC)

(TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

116.4

135.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

72.5

78.8

°C/W

RθJB

Junction-to-board thermal resistance

72.4

63.9

°C/W

ψJT

Junction-to-top characterization parameter

30.8

14.2

°C/W

ψJB

Junction-to-board characterization parameter

78.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

TLV9041, TLV9042, TLV9044

SBOS836C – MARCH 2020 – REVISED MARCH 2021

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Product Folder Links: TLV9041 TLV9042 TLV9044

TLV9042IDDFR Datasheet(PDF) 8 Page - Texas Instruments

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