TLV9302IDDFR datasheet(5/55 Pages) TI

5 / 55 page

6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

Signal input pins

Common-mode voltage(3)

(V–) – 0.5

(V+) + 0.5

Differential voltage(3) (4)

VS + 0.2

Current(3)

–10

Output short-circuit(2)

Continuous

Operating ambient temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Short-circuit to ground, one amplifier per package.

(3)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(4)

Large differential voltages applied between IN+ and IN– for extended periods of time may cause a long-term shift to the input offset

voltage. This effect increases as temperature rises above 25°C.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

4.5

Input voltage range

(V–) – 0.1

(V+) – 2

Specified temperature

–40

125

°C

6.4 Thermal Information for Single Channel

THERMAL METRIC(1)

TLV9301

UNIT

DBV (SOT-23)

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

192.5

203.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

113.3

116.2

°C/W

RθJB

Junction-to-board thermal resistance

60.2

51.7

°C/W

ψJT

Junction-to-top characterization parameter

37.6

24.6

°C/W

ψJB

Junction-to-board characterization parameter

60.1

51.9

°C/W

www.ti.com

TLV9301, TLV9302, TLV9304

SBOS941C – FEBRUARY 2019 – REVISED FEBRUARY 2021

Submit Document Feedback

Product Folder Links: TLV9301 TLV9302 TLV9304

TLV9302IDDFR Datasheet(PDF) 5 Page - Texas Instruments

TLV9302IDDFR Datasheet(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

Datasheet Download

Link URL