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TMUX7208 Datasheet(PDF) 4 Page - Texas Instruments |
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TMUX7208 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 51 page ![]() 6 Pin Configuration and Functions 1 A0 16 A1 2 EN 15 A2 3 VSS 14 GND 4 S1 13 VDD 5 S2 12 S5 6 S3 11 S6 7 S4 10 S7 8 D 9 S8 Not to scale Figure 6-1. TMUX7208: PW Package 16-Pin TSSOP Top View 1 VSS 12 GND 2 S1 11 VDD 3 S2 10 S5 4 S3 9 S6 Not to scale Thermal Pad Figure 6-2. TMUX7208: RUM Package 16-Pin WQFN Top View Table 6-1. TMUX7208 Pin Functions NAME PW NO. RUM NO. TYPE(1) DESCRIPTION(2) A0 1 15 I Logic control input, has internal pull-down resistor. Controls the switch configuration as shown in Section 9.5. A1 16 14 I Logic control input, has internal pull-down resistor. Controls the switch configuration as shown in Section 9.5. A2 15 13 I Logic control input, has internal pull-down resistor. Controls the switch configuration as shown in Section 9.5. D 8 6 I/O Drain pin. Can be an input or output. EN 2 16 I Active high logic enable, has internal pull-down resistor. When this pin is low, all switches are turned off. When this pin is high, the Ax logic input determines which switch is turned on. GND 14 12 P Ground (0 V) reference. S1 4 2 I/O Source pin 1. Can be an input or output. S2 5 3 I/O Source pin 2. Can be an input or output. S3 6 4 I/O Source pin 3. Can be an input or output. S4 7 5 I/O Source pin 4. Can be an input or output. S5 12 10 I/O Source pin 5. Can be an input or output. S6 11 9 I/O Source pin 6. Can be an input or output. S7 10 8 I/O Source pin 7. Can be an input or output. S8 9 7 I/O Source pin 8. Can be an input or output. VDD 13 11 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VDD and GND. VSS 3 1 P Negative power supply. This pin is the most negative power-supply potential. In single- supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 μF to 10 μF between VSS and GND. Thermal Pad — The thermal pad is not connected internally. No requirement to solder this pad, if connected it is recommended that the pad be left floating or tied to GND. (1) I = input, O = output, I/O = input and output, P = power. (2) Refer to Section 9.4 for what to do with unused pins. TMUX7208, TMUX7209 SCDS418B – JULY 2020 – REVISED APRIL 2021 www.ti.com 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TMUX7208 TMUX7209 |
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