LM4864MMSLASHNOPB datasheet(4/27 Pages) TI

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LM4864

SNAS109F – SEPTEMBER 1999 – REVISED MAY 2013

www.ti.com

Operating Ratings

Temperature Range

TMIN ≤ TA ≤ TMAX

−40°C ≤ TA ≤ +85°C

Supply Voltage

2.7V

≤ VDD ≤ 5.5V

Electrical Characteristics VDD = 5V

(1) (2)

The following specifications apply for VDD = 5V, for all available packages, unless otherwise specified. Limits apply for TA =

25°C

LM4864

Units

Symbol

Parameter

Conditions

(Limits)

Typical (3)

Limit (4)(5)

IDD

Quiescent Power Supply Current

VIN = 0V, IO = 0A

(6)

3.6

6.0

mA (max)

ISD

Shutdown Current

VPIN1 = VDD

0.7

μA (max)

VOS

Output Offset Voltage

VIN = 0V

mV (max)

Output Power

THD = 1% (max); f = 1 kHz; RL = 4Ω;

625

mW (min)

LM4864LD (7)

THD = 1% (max); f = 1 kHz; RL = 8Ω;

725

mW (min)

LM4864LD (7)

THD = 1% (max); f = 1 kHz; RL = 8Ω;

300

mW (min)

LM4864MM (8)

THD = 1% (max); f = 1 kHz; RL = 8Ω;

675

300

mW (min)

LM4864M and LM4864N*

THD+N = 1%; f = 1 kHz; RL = 16Ω;

550

THD+N

Total Harmonic Distortion+Noise

PO = 300 mWrms; AVD = 2; RL = 8Ω;

0.7

20 Hz

≤ f ≤ 20 kHz, BW < 80kHz

PSRR

Power Supply Rejection Ratio

VDD = 4.9V–5.1V

(1)

All voltages are measured with respect to the ground pin, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication

of device performance.

(3)

Typicals are measured at 25°C and represent the parametric norm.

(4)

Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(5)

Datasheet min/max specification limits are specified by design, test, or statistical analysis.

(6)

The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.

(7)

The NGY0010A package has its exposed-DAP soldered to an exposed 1.2in2 area of 1oz printed circuit board copper.

(8)

The DGK0008BA package is thermally limited to 595 mW of power dissipation at room temperature. Referring to Figure 21 in Typical

Performance Characteristics, the power dissipation limitation for the package occurs at 300 mW of output power. This package limitation

is based on 25°C ambient temperature and

θJA = 210°C. For higher output power possibilities refer to POWER DISSIPATION.

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