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MCP3461RT-E/ST Datasheet(PDF) 32 Page - Microchip Technology |
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MCP3461RT-E/ST Datasheet(HTML) 32 Page - Microchip Technology |
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32 / 118 page  MCP3461/2/4R DS20006404C-page 32 2020-2021 Microchip Technology Inc. 3.9 Analog Ground (AGND) AGND is the ground connection to internal analog circuitry. To ensure accuracy and noise cancellation, this pin must be connected to the same ground as DGND, preferably with a star connection. If an analog ground plane is available, it is recommended that this pin be tied to this plane of the PCB. This plane should also reference all other analog circuitry in the system. AGND is the biasing voltage for the substrate of the die and is not internally connected to DGND. 3.10 Exposed Pad (EP) This pad is only available on the UQFN package. The pad is internally connected to AGND. It must be con- nected to the analog ground of the PCB for optimal accuracy and thermal performance. This pad can also be left floating if necessary. |
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